Sealing method for heat conducting components

A technology of heat-conducting components and components, applied in the construction of components of electrical equipment, modification through conduction heat transfer, electrical components, etc., can solve problems such as circuit short circuit and leakage

Active Publication Date: 2017-02-15
NUBIA TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as heat dissipation materials used in electronic products, metal phase change materials will undergo phase changes during use, which may cause leakage problems and cause short circuits in circuits

Method used

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  • Sealing method for heat conducting components
  • Sealing method for heat conducting components
  • Sealing method for heat conducting components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0082] The embodiment of the present invention proposes a mobile terminal. A schematic diagram of the hardware structure of the mobile terminal is as figure 1 Shown.

[0083] When the first heat conducting component is arranged on the chip, it contacts the chip and surrounds the chip.

[0084] In this embodiment, as image 3 As shown, the mobile terminal includes:

[0085] PCB 31;

[0086] The chip 32 is fixed on the PCB 31, and the chip 32 can generate heat during operation;

[0087] The shielding cover 33 is fixed to the PCB 31 and surrounds the chip 32, and the shielding cover 33 is provided with a through hole;

[0088] A first heat conducting component 34, sealing the through hole, and forming a groove at the through hole, and the bottom of the groove is in contact with the surface of the chip 32;

[0089] The second heat conducting component 35 is filled in the groove; the second heat conducting component 35 is a metallic phase change material;

[0090] The heat-conducting middle fra...

Embodiment 2

[0116] The embodiment of the present invention proposes a mobile terminal. A schematic diagram of the hardware structure of the mobile terminal is as figure 1 Shown.

[0117] When the first heat conducting component is arranged on the chip, it contacts the chip and surrounds the chip.

[0118] In this embodiment, as image 3 As shown, the mobile terminal includes:

[0119] PCB 31;

[0120] The chip 32 is fixed on the PCB 31, and the chip 32 can generate heat during operation;

[0121] The shielding cover 33 is fixed to the PCB 31 and surrounds the chip 32, and the shielding cover 33 is provided with a through hole;

[0122] A first heat conducting component 34, sealing the through hole, and forming a groove at the through hole, and the bottom of the groove is in contact with the surface of the chip 32;

[0123] The second heat conducting component 35 is filled in the groove; the second heat conducting component 35 is a metallic phase change material;

[0124] The heat-conducting middle fra...

Embodiment 3

[0159] Based on the mobile terminal provided in the first embodiment of the present invention, this embodiment provides a method for sealing a thermally conductive component, such as Figure 4 As shown, the method includes the following steps:

[0160] Step 401: Fix a shielding cover provided with a through hole on the PCB where the chip is fixed, and surround the chip;

[0161] Here, the chip can generate heat during operation.

[0162] In an embodiment, the method may further include:

[0163] The chip is fixed on the PCB by means of patch.

[0164] Among them, in practical applications, the most commonly used patching method is: soldering the chip on the PCB by using solder bars (wires) or the like.

[0165] Correspondingly, the shielding cover can be fixed on the PCB by means of patches.

[0166] In practical applications, through holes can be formed on the shielding cover by stamping.

[0167] In practical applications, the chip may generally be a CPU or the like.

[0168] The shieldin...

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PUM

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Abstract

The invention discloses a sealing method for heat conducting components. The sealing method comprises the steps as follows: a shielding case with a through hole is fixed on a printed circuit board (PCB) fixed with a chip and surrounds a chip; the chip can generate heat when working; the through hole is sealed by using a first heat conducting component and a groove is formed in the through hole; the bottom of the groove is in contact with the surface of the chip; the groove is filled with a conductive second heat conducting component; the second heat conducting component is made of a metal phase-change material; and a middle frame is connected with the first heat conducting component, wherein the second heat conducting component is located in a sealed space.

Description

Technical field [0001] The present invention relates to terminal technology, in particular to a method for sealing a thermally conductive component. Background technique [0002] With the development of smart electronic products, the number of cores of the central processing unit (CPU) is increasing; users’ pursuit of large-scale three-dimensional (3D) games and high-definition video has led to the development of mobile phones, tablets and other products. The increasing heat has seriously affected the user experience. [0003] In order to solve the heat dissipation problem of these smart electronic products, it is proposed to use metal phase change materials with high thermal conductivity as the heat dissipation materials used in electronic products. However, as a heat dissipation material used in electronic products, metallic phase change materials undergo phase change during use, which may cause leakage problems, which may cause short circuits in circuits. [0004] Therefore, how...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039H05K7/20463H05K7/205
Inventor 龙静罗孝平陈浪
Owner NUBIA TECHNOLOGY CO LTD
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