A head-up display highly integrated module cooling structure

A technology with a heat dissipation structure and high integration, applied in the structural parts of electrical equipment, cooling/ventilation/heating renovation, electrical components, etc., which can solve the problems that affect the performance of HUD products and cannot effectively dissipate heat from highly integrated HUD.

Active Publication Date: 2019-04-16
LUOYANG INST OF ELECTRO OPTICAL EQUIP OF AVIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional HUD heat dissipation methods can no longer effectively dissipate heat for highly integrated HUDs. Heat dissipation has become an urgent problem to be solved for highly integrated HUDs. This problem will affect the performance of HUD products. Therefore, it is necessary to design a heat dissipation structure for highly integrated HUD modules.

Method used

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  • A head-up display highly integrated module cooling structure
  • A head-up display highly integrated module cooling structure
  • A head-up display highly integrated module cooling structure

Examples

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Embodiment Construction

[0035] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0036] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than ...

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Abstract

The invention provides a highly-integrated module heat radiation structure of a head up display. The highly-integrated module heat radiation structure comprises a combining unit, a main channel casing and a fin channel casing cover plate, wherein the combining unit comprises a heat radiation fin, a fin channel casing, a heat pipe, a main channel casing cover plate, a first heat pipe and a second heat pipe; a bulge of the main channel casing cover plate of the combining unit is completely attached with a bulge of a module. The highly-integrated module heat radiation structure has the advantages that the main channel casing, the combining unit and the fin channel cover plate are welded into the highly-integrated module heat radiation structure of the head up display by a brazing method; by utilizing the excellent heat radiation and air ventilation channel and the heat radiation property, the heat of the highly-integrated module can be quickly transferred to the exterior of the head up display.

Description

technical field [0001] The invention belongs to the field of heat dissipation structure design for electronic equipment, and relates to a heat dissipation structure for airborne electronic equipment, in particular to a heat dissipation structure for a head-up display highly integrated module. Background technique [0002] HUD products are developing in the direction of small space, high power consumption and high integration. Traditional HUD heat dissipation methods can no longer effectively dissipate heat for highly integrated HUDs. Heat dissipation has become an urgent problem to be solved for highly integrated HUDs. This problem will affect the performance of HUD products. Therefore, it is necessary to design a heat dissipation structure for highly integrated HUD modules. . [0003] The heat dissipation technology commonly used in foreign head-up displays is cold plate and locker transfer heat dissipation. For high-integration head-up displays, this heat dissipation meth...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20963H05K7/20972
Inventor 李彦山靳凯强张虎武晓军孙晓辉王彦军
Owner LUOYANG INST OF ELECTRO OPTICAL EQUIP OF AVIC
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