LED (light emitting diode) heat radiation packaging structure with air outlet at side face

A side air outlet and encapsulation structure technology, applied in cooling/heating devices of lighting devices, lighting devices, lighting and heating equipment, etc., can solve problems such as complex operation, danger, and heat transport crisis, and achieve good heat dissipation performance, Compact structure and powerful effect

Active Publication Date: 2012-11-21
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among these methods, water cooling and oil cooling have problems such as large volume, complicated operation, regular maintenance and replacement, and the deformation of the drive parts due to long-term operation, which will reduce the performance of the components; the heat pipe can play a better role in heat transfer under a certain power However, when the LED integration degree and calorific value are large, the liquid in the entire heat pipe will be evaporated due to excessive heat, which will cause the working fluid to be unable to circulate, so there will be a heat transport crisis, and even cause danger in serious cases; consider Until the cost of air cooling is low, the formed LED products on the market are still dominated by natural convection using fins to increase the heat transfer area or forced convection cooling combined with fan fins

Method used

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  • LED (light emitting diode) heat radiation packaging structure with air outlet at side face
  • LED (light emitting diode) heat radiation packaging structure with air outlet at side face
  • LED (light emitting diode) heat radiation packaging structure with air outlet at side face

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Embodiment 1

[0031] figure 1 It is a structural diagram of the LED heat dissipation package with side air outlets of the present invention, image 3 Its assembly diagram is also an embodiment of the present invention, diagram 2-1 with Figure 2-2 for figure 1 A-A surface (vertically bisecting the cross-section of the flat mounting plate 2 and the surrounding hollow flow channel 3); it can be seen from the figure that the LED heat dissipation package structure with side air outlets of the present invention includes:

[0032] A flat mounting plate 2 as a heat sink for the LED light-emitting module;

[0033] A surrounding hollow flow channel 3 surrounding the side walls around the flat mounting plate 2, and a surrounding slit-shaped opening 31 is provided on the inner flow channel wall of the surrounding hollow flow channel 3;

[0034] A hollow base 4 that is located at the lower end of the surrounding hollow flow channel 3 and communicates with the surrounding hollow flow channel 3; a h...

Embodiment 2

[0046] attached Figure 4 It is a schematic cross-sectional view of an LED heat dissipation package structure with side air outlets (surrounding slit-like openings 31 ) at the front and back of the flat mounting plate 2 ; it is also another embodiment of the present invention.

[0047] It can be seen from the figure that all the structures of this embodiment are the same as those of Embodiment 1 except that surrounding slit-like openings 31 (side air outlets) are provided at the front and back of the flat mounting plate 2 . At this time, in addition to setting a surrounding slit-shaped opening before the flat mounting plate 2, a surrounding slit-shaped opening is also set behind the flat mounting plate 2; the advantage of this structure is that through the flat mounting plate The surrounding slit-shaped opening behind the plate 2 cools the rear end of the flat mounting plate 2, which can further enhance the heat dissipation effect, thereby ensuring the safe and stable operatio...

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Abstract

The invention relates to an LED (light emitting diode) heat radiation packaging structure with an air outlet at one side face. The structure comprises a flat-plate mounting plate, a circulating hollow flow channel, a hollow base and a power supply 44, wherein the flat-plate mounting plate acts as a heat sink of an LED light emitting module; the circulating hollow flow channel surrounds the peripheral side wall of the flat-plate mounting plate; the inner side flow channel wall of the circulating hollow flow channel is provided with a circulating gap-shaped opening; the hollow base is positioned at the lower end of the circulating hollow flow channel and is communicated with the circulating hollow flow channel; the middle part of the interior of the hollow base is provided with a horizontalfilter, and the wall surface of the hollow base below the filter is provided with an air inlet; an air driving component is arranged above the filter; and the power supply 44 is positioned at the bottom of the hollow base and provides energy for the air driving component and the LED lighting module. The LED heat radiation packaging structure with the air outlet at one side drives air to be cooledfrom the side of the LED through the air driving component, and heat is exhausted through the mounting plate and the front end of the mounting plate; and the structure has the advantages of compact structure, beautiful appearance, low noise, environmental friendliness, and the like.

Description

technical field [0001] The present invention relates to an LED heat dissipation packaging structure with a side air outlet, in particular to a forced air cooling heat dissipation structure for cooling the LED by sucking air from the base into the flow channel surrounding the LED by means of the bottom driving part . Background technique [0002] In recent years, with the rapid development of urban construction and electronic information industry, people's demand for light sources is increasing day by day. Among them, the development and production of LED (Light-Emitting Diode) products has become a sunrise industry with very attractive prospects. This kind of light source can not only be used as large-scale advertising display screen, traffic signal indicator light, night scene lighting of key urban buildings, etc., but also is rapidly becoming the standard configuration of automobiles, especially white light LED has been used as the main light source of display screens of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V19/00F21V29/00F21V29/60
Inventor 刘静马璐
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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