Sheet adhesion device and adhesion method

Abstract

The sheet adhesion device (10) includes a first holding unit (20) for holding an attached body (WF); a second holding unit (30) opposing one surface (AS1) of an adhesive sheet (AS) to the attached body (WF) held by the first holding unit (20) to hold the adhesive sheet (AS); a fluid supply unit (40) for supplying a fluid, and a pressing unit (50) for pressing and attaching the adhesive sheet (AS) held by the second holding unit (30) against the adhesive body (WF) held by the first holding unit (20). The second holding unit (30) can be formed with a closed space (SP) including the adhesive sheet (AS) and enclosing the first holding unit (20). The fluid supply unit (40) supplies a fluid to the closed space (SP) to make the adhesive sheet (AS) deform in a direction away from the adhesive body (WF).The deformed adhesive sheet (AS) is pressed and adhered to the adhesive body (WF) by the pressing unit (50).

Description

Technical field [0001] The invention relates to a sheet adhering device and an adhering method. Background technique [0002] At present, there is known a sheet adhering device that adheres an adhesive sheet arranged opposite to an adherend such as a semiconductor wafer (hereinafter referred to as a wafer) on the adherend (for example, refer to Document 1: Japanese Special Bulletin No. 2014-27081). [0003] Patent Document 1: Japanese Patent Application Publication No. 2014-27081 [0004] However, the conventional sheet adhering device described in Document 1 blows gas as a fluid to the adhesive sheet in an open space, and adheres the adhesive sheet while keeping a certain distance from the wafer on the wafer. The fluid must be continuously supplied until the adhesion operation is completed, and there is a problem that fluid consumption increases sharply. [0005] In addition, since the distance between the adhesive sheet and the wafer needs to be kept constant, there is a problem t...

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Problems solved by technology

[0004] However, in the conventional sheet adhering apparatus described in Document 1, the gas as a fluid is blown onto the adhesive sheet in an open space, and the adhesive sheet is attached to the wafer with the adhesive sheet kept at a certain distance from the wafer. Fluid must be continuously supplied until the sticking operation ends, and there is a problem that the consumption of fluid increases rapidly

[0005] In addition, since the distance between the adhesive sheet and the wafer needs to be kept constant, there is a problem that the control for supplying the fluid becomes complicated.

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