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Coil, inductance component and method for fabricating coil applied to inductance component

A technology of inductive components and coils, which is applied in the direction of coil manufacturing, electrical components, printed circuits connected with non-printed electrical components, etc., can solve the problems of greatly affecting the performance of inductive components, reducing the self-resonant frequency and quality factor of inductive components, etc. , to achieve high Q value, small parasitic coupling capacitance between layers, and high impedance value

Active Publication Date: 2017-03-22
XYTECH ELECTRONICS TECH SHANGHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This will have a great impact on the performance of the inductive component, for example, it will reduce the self-resonant frequency and quality factor Q of the inductive component

Method used

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  • Coil, inductance component and method for fabricating coil applied to inductance component
  • Coil, inductance component and method for fabricating coil applied to inductance component
  • Coil, inductance component and method for fabricating coil applied to inductance component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] Specific embodiments will be supplemented with descriptions in the accompanying drawings of the present invention. figure 1 It is a preferred schematic diagram of a 12-turn coil used for making an inductance element according to the present invention. The coil may be composed of a spiral conductive ring, and the width of the spiral conductive ring is not all the same. figure 2 appear as with figure 1 A preferred schematic diagram of the three-layer conductive layer distribution of the coil in . The coil consists of 3 conductive layers. The upper conductive layer has 6 conductive rings, the 6 conductive rings have the same shape but different sizes, and they are arranged neatly; the middle conductive layer has 6 conductive rings, the 6 conductive rings have the same shape but different sizes, and They are arranged neatly; the lower conductive layer has a conductive bridge, and the conductive bridge connects the innermost conductive ring of the middle conductive laye...

Embodiment 2

[0065] Such as image 3 As shown, the inductance coil has three conductive layers, namely the upper conductive layer, the middle conductive layer and the lower conductive layer; the upper conductive layer has two conductive rings 33, 34, these two conductive rings have the same shape but different sizes, and the arrangement The cloth is neat; there are two conductive rings 35 and 36 in the middle conductive layer. These two conductive rings have the same shape but different sizes and are neatly arranged; all the conductive rings of this coil are spiral conductive rings. For the convenience of description, the spiral conductive rings are called for the conductive ring. The coil also includes a conductive bridge configured to connect the inner conductive ring of the middle layer conductive bridge with the second end electrode. Optionally, the conductive bridge can be placed in the upper conductive layer or the middle conductive layer. Optionally, the conductive bridge can also ...

Embodiment 3

[0074] Such as Figure 7 As shown, the inductance element (inductance coil) is composed of two coils according to the present invention, which are respectively the coil on the left and the coil on the right. The coil on the left is rotated 90° counterclockwise, and the coil on the right is rotated 90° clockwise, so that the geometric center of one of the coils has a displacement to the left, and the geometric center of the other coil moves to the right, so that the two coils can be connected in series way to connect. Each coil includes three conductive layers: an upper layer, a middle layer and a lower layer. The coils here all have the same or similar topological design and electrical performance of the coils described in Embodiment 2 of the present invention. However due to the rotation of the coil, the current in Figure 7 The coil shown on the left flows clockwise, while the current in the Figure 7 Flow is counterclockwise in the coil shown on the right. That is to s...

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PUM

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Abstract

The invention provides a coil, an inductance component and a method for fabricating the coil applied to the inductance component. The coil comprises multiple conductive layers, wherein at least two conductive layers each comprises at least one conductive ring, the conductive rings are electrically connected to form the coil, a first end electrode is connected with an external conductive ring, a second end electrode is connected with an internal conductive ring, the geometric center of the conductive ring of at least one conductive layer and the geometric center of the conductive ring of the conductive layer on or / under the at least one conductive layer are not aligned in a space, the conductive rings can be spiral conductive rings, the widths of the spiral conductive rings are not complete same, the coil can be used for fabricating the inductance component with a high inductance value and can be widely used in a circuit, and each conductive layer of the coil can be fabricated by a semiconductor process or a PCB (Printed Circuit Board) process. The coil has high inductance value and a high quality factor Q value, and the parasitic coupling capacitance can also be effectively reduced.

Description

technical field [0001] The invention relates to the technical field of electronic devices, in particular to a coil, an inductance element and a method for preparing the coil for the inductance element. Background technique [0002] Inductance is a common component in electronic circuits, and the inductance element used in integrated circuits or printed circuit boards must have at least one conductive coil. With the development of integrated circuit technology, single-layer conductive layers or multi-layer conductive layers are usually used to prepare these components. However, if a single-layer structure is used, usually the coil needs to occupy a large area to obtain a large inductance, so a coil with a multi-layer conductive layer structure is used to design the inductance element. However, the inductance element of the coil based on the multilayer conductive layer structure has some key defects, such as defects in self-resonant frequency and Q value. [0003] For exampl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/28H01F17/00H01F41/04H05K1/18H10N97/00
CPCH01L28/10H01F2017/002H01F27/2804H01F41/041H01F2027/2809H01L23/5227H05K1/165
Inventor 拉斐尔·瓦伦丁
Owner XYTECH ELECTRONICS TECH SHANGHAI CO LTD