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Coil, inductance element and method for preparing coil applied to inductance element

A technology of inductance components and coils, which is applied in coil manufacturing, electrical components, printed circuits connected to non-printed electrical components, etc. , to achieve the effect of high Q value, small parasitic coupling capacitance between layers, and high self-corresponding frequency

Active Publication Date: 2019-08-27
XYTECH ELECTRONICS TECH SHANGHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This will have a great impact on the performance of the inductive component, for example, it will reduce the self-resonant frequency and quality factor Q of the inductive component

Method used

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  • Coil, inductance element and method for preparing coil applied to inductance element
  • Coil, inductance element and method for preparing coil applied to inductance element
  • Coil, inductance element and method for preparing coil applied to inductance element

Examples

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Effect test

Embodiment 1

[0054] Specific embodiments will be supplemented with descriptions in the accompanying drawings of the present invention. figure 1 It is a preferred schematic diagram of a 12-turn coil used for making an inductance element according to the present invention. The coil may be composed of a spiral conductive ring, and the width of the spiral conductive ring is not all the same. figure 2 appear as with figure 1 A preferred schematic diagram of the three-layer conductive layer distribution of the coil in . The coil consists of 3 conductive layers. The upper conductive layer has 6 conductive rings, these 6 conductive rings have the same shape but different sizes, and they are arranged neatly; the middle conductive layer has 6 conductive rings, these 6 conductive rings have the same shape but different sizes, and They are arranged neatly; the conductive rings are all conductive rings with more than 1 turn and less than 2 turns, and are composed of a first end conductive ring seg...

Embodiment 2

[0065] Such as image 3As shown, the inductance coil has three conductive layers, namely the upper conductive layer, the middle conductive layer and the lower conductive layer; the upper conductive layer has two conductive rings 33, 34, these two conductive rings have the same shape but different sizes, and the arrangement Neatly arranged; the middle conductive layer has two conductive rings 35, 36, the shape of these two conductive rings is the same but different in size, and they are neatly arranged; all the conductive rings of the coil are spiral conductive rings, and the conductive rings are larger than 1 turn and smaller than 2 turns of conductive rings, each conductive ring is composed of a first end conductive ring segment, a second end conductive ring segment and a middle ring segment. For the convenience of description, the spiral conductive ring is called a conductive ring. The coil also includes a conductive bridge configured to connect the inner conductive ring of...

Embodiment 3

[0074] Such as Figure 7 As shown, the inductance element (inductance coil) is composed of two coils according to the present invention, which are respectively the coil on the left and the coil on the right. The coil on the left is rotated 90° counterclockwise, and the coil on the right is rotated 90° clockwise, so that the geometric center of one of the coils has a displacement to the left, and the geometric center of the other coil moves to the right, so that the two coils can be connected in series way to connect. Each coil includes three conductive layers: an upper layer, a middle layer and a lower layer. The coils here all have the same or similar topological design and electrical performance of the coils described in Embodiment 2 of the present invention. However due to the rotation of the coil, the current in Figure 7 The coil shown on the left flows clockwise, while the current in the Figure 7 Flow is counterclockwise in the coil shown on the right. That is to s...

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PUM

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Abstract

The invention provides a coil, an inductance element and a method for preparing the coil applied to the inductance element. The coil includes multiple conductive layers, wherein at least two layers of conductive layers include at least one conductive ring; wherein the conductive ring is electrically connected to form a coil; and the first end electrode is connected to the outer conductive ring, and the second end electrode is connected to the inner conductive ring and the geometric center of the conductive ring of at least one conductive layer and the geometric center of the conductive ring of the adjacent conductive layer are not aligned with each other in space. The conductive ring can be a spiral conductive ring, and the widths of the spiral conductive rings are not all the same; the coil can be used to prepare an inductance element with high inductance value, and can be widely used in circuits. Each conductive layer of the coil can be prepared by using a semiconductor process or a PCB process. The coil has a high inductance value and a high quality factor Q value, and can also effectively reduce parasitic coupling capacitance.

Description

technical field [0001] The invention relates to the technical field of electronic devices, in particular to a coil, an inductance element and a method for preparing the coil for the inductance element. Background technique [0002] Inductance is a common component in electronic circuits, and the inductance element used in integrated circuits or printed circuit boards must have at least one conductive coil. With the development of integrated circuit technology, single-layer conductive layers or multi-layer conductive layers are usually used to prepare these components. However, if a single-layer structure is used, usually the coil needs to occupy a large area to obtain a large inductance, so a coil with a multi-layer conductive layer structure is used to design the inductance element. However, the inductance element of the coil based on the multilayer conductive layer structure has some key defects, such as defects in self-resonant frequency and Q value. [0003] For exampl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F27/28H01F17/00H01F41/04H05K1/18H10N97/00
CPCH01L28/10H01F2017/002H01F27/2804H01F41/041H01F2027/2809H01L23/5227H05K1/165
Inventor 拉斐尔·瓦伦丁
Owner XYTECH ELECTRONICS TECH SHANGHAI CO LTD