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Coil, inductive device and method of making a coil for use in an inductive device

An inductive device and coil technology, applied in coil manufacturing, inductors, fixed inductors, etc., can solve the performance impact of inductive devices, reduce the self-resonant frequency and quality factor of inductive devices, etc., to achieve high Q value, interlayer parasitic The effect of small coupling capacitance and high self-response frequency

Active Publication Date: 2019-02-12
XYTECH ELECTRONICS TECH SHANGHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can have a significant impact on the performance of the inductive device, such as reducing the self-resonant frequency and quality factor Q of the inductive device

Method used

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  • Coil, inductive device and method of making a coil for use in an inductive device
  • Coil, inductive device and method of making a coil for use in an inductive device
  • Coil, inductive device and method of making a coil for use in an inductive device

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Experimental program
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Effect test

Embodiment 1

[0049] Specific embodiments will be supplemented with descriptions in the accompanying drawings of the present invention. figure 1 Shown is a preferred schematic diagram of a coil with 9 turns for use in the fabrication of an inductive device according to the present invention. figure 2 shown as figure 1 A preferred schematic diagram of the distribution of the four conductive layers of the coil in . The coil consists of 4 conductive layers, figure 2 The leftmost one is the upper conductive layer, the middle one is the upper middle conductive layer, and the rightmost one is the plan view of the middle lower conductive layer and the lower conductive layer. The conductive track of each conductive layer is connected with the conductive track of the adjacent conductive layer through a pair of metal conductive holes.

[0050] The coil includes four conductive layers, wherein the three conductive layers are the upper conductive layer, the upper middle conductive layer, the mid...

Embodiment 2

[0061] The following will combine image 3 Embodiment 2 of the present invention will be described. image 3 It is a schematic plan view of the upper conductive layer, the middle conductive layer, and the lower conductive layer of another preferred coil of the present invention. image 3 The left side is the upper conductive layer, and the right side is the middle conductive layer and the lower conductive layer. In the schematic plan view, the coil further includes metal conductive holes for electrically connecting the conductive traces in one conductive layer with the conductive traces in the adjacent conductive layer.

[0062]The coil includes three conductive layers, wherein the second conductive layer is the upper conductive layer, the middle conductive layer, and the other conductive layer is the lower conductive layer. The upper conductive layer includes two conductive tracks 201, 207, wherein the outer conductive track 201 is composed of a conductive spiral ring 1011,...

Embodiment 3

[0073] The present invention also provides another preferred embodiment. Figure 4 A schematic plan view of the upper conductive layer, the upper middle conductive layer, the lower middle conductive layer, and the lower conductive layer of another preferred coil is shown. The schematic plan view of each conductive layer includes metal conductive holes for electrically connecting the conductive traces of each conductive layer with the conductive traces of adjacent layers.

[0074] In this embodiment, the preferred coil includes 4 conductive layers, wherein the three conductive layers are the upper conductive layer, the upper middle conductive layer, the lower middle conductive layer, and the other conductive layer is the lower conductive layer. The upper conductive layer includes a conductive trace 307, wherein the conductive trace 307 is composed of two conductive spiral loops 3071, 3072, that is, the conductive trace 307 is a conductive spiral with 2 turns. The upper and mid...

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PUM

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Abstract

The invention provides a coil, an induction device and a method for preparing the coil applied to the induction device. The coil comprises a plurality of conducting layers and another conducting layer, wherein each conducting layer at least comprises a conducting track; each conducting track can be a circle of conducting screw or two circles of conducting screws or a ring-section conducting screw; at least one conducting track is two circles of conducting screws; the another conducting layer comprises one conducting track; the conducting track can be a conducting bridge; the conducting bridge is used for electrically connecting a second terminal electrode of the coil and one conducting track in the plurality of conducting layers; a first terminal electrode of the coil is electrically connected with another conducting track in the plurality of conducting layers; all conducting tracks of the coil are isolated from one another through an insulating material; and all conducting tracks are electrically connected to from the coil. The coil can be used for preparing a high-inductance value induction device and can be widely applied to a circuit. The conducting layers of the coil can be prepared by a semiconductor technology, an integrated passive device (IPD) technology or a PCB technology; the coil has a high inductance value and a high quality factor Q value; and the parasitic coupling capacitance and resistance can also be effectively reduced.

Description

technical field [0001] The invention relates to the technical field of electronic devices, in particular to a coil, an inductance device and a method for preparing a coil for the inductance device. Background technique [0002] Inductance is a common component in electronic circuits. An inductance device used in an integrated circuit or a printed circuit board must have at least one conductive trace. With the development of integrated circuit technology, single-layer conductive layers or multi-layer conductive layers are usually used to prepare these components. However, if a single-layer structure is used, usually the coil needs to occupy a larger area to obtain a larger inductance, so the coil with a multi-layer conductive layer structure is used to design the inductance device. However, the inductance device based on the coil of the multilayer conductive layer structure has some key defects, such as defects in self-resonant frequency and Q value. [0003] 专利号为:7,489,220...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F27/28H01F17/00H01F41/04H01L23/64
Inventor 拉斐尔·瓦伦丁
Owner XYTECH ELECTRONICS TECH SHANGHAI CO LTD