Pressure sensitive conductive adhesive composition and preparation method thereof
A composition, conductive adhesive technology, applied in conductive adhesives, adhesive additives, adhesive types, etc., can solve the problems of limiting the conductivity of the system and restricting the use of adhesives
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Embodiment 1
[0014] This embodiment 1 provides a pressure-sensitive conductive adhesive composition with a lower impedance value, which is a conductive pressure-sensitive adhesive composed of a pressure-sensitive adhesive and metal conductive particles. 30~80% of the total weight of the agent, wherein the composition (by weight percentage) of the pressure-sensitive adhesive is as follows:
[0015] Acrylic soft monomer 30-50%, acrylic hard monomer 5-20%, carboxyl-containing functional monomer 0.5-2.5%, hydroxyl-containing cross-linking monomer 0.5-2.5%, non-alcohol solvent 40-60% , Oil-soluble initiator 0.2-2.0%, mercaptan chain transfer agent 0.01-0.2%.
[0016] The acrylic soft monomer in the above-mentioned pressure-sensitive conductive adhesive composition includes: any one or any combination of ethyl acrylate, butyl acrylate, butyl methacrylate, ethylhexyl acrylate, and isooctyl acrylate. species composition.
[0017] The acrylic hard monomer includes any one or combination of any of...
Embodiment 2
[0030] An embodiment of the present invention provides a pressure-sensitive conductive adhesive composition with a lower impedance value, the pressure-sensitive conductive adhesive composition is mainly composed of a pressure-sensitive adhesive and metal conductive particles, wherein the pressure-sensitive adhesive The composition and weight percentage are as follows:
[0031] Pressure Sensitive Resin Raw Material Weight
[0032] Isooctyl acrylate (EHA) 220kg
[0033] Ethyl acrylate (EA) 150kg
[0034] Methyl methacrylate (MMA) 130kg
[0035] Acrylic acid (AA) 10kg
[0036] Hydroxyethyl Acrylate (HEA) 15kg
[0037] Hydroxypropyl Acrylate (HPA) 5kg
[0038] Benzoyl peroxide (BPO) 9kg
[0039] Ethyl acetate 320kg
[0040] Toluene 140kg
[0041] Dodecanethiol 11kg
[0042] Conductive particle raw material weight
[0044] Silver-plated copper powder 50kg
[0045] The preparation method of above-mentioned pressure-sensitive conductive adhesi...
Embodiment 3
[0050] Embodiment 3 of the present invention provides a pressure-sensitive conductive adhesive composition with a lower impedance value. The pressure-sensitive conductive adhesive composition is mainly composed of a pressure-sensitive adhesive and metal conductive particles, wherein the pressure-sensitive adhesive The composition and weight percentage of agent are as follows:
[0051] raw material weight
[0052] Butyl acrylate 380kg
[0053] Methyl acrylate 70kg
[0054] Methyl methacrylate 50kg
[0055] Acrylic 10kg
[0056] Methacrylic acid 5kg
[0057] Hydroxyethyl Acrylate 20kg
[0058] Benzoyl Peroxide 10kg
[0059] Ethyl acetate 204kg
[0060] Toluene 250kg
[0061] Dodecanethiol 1kg
[0062] Conductive particle raw material weight
[0063] Silver-plated aluminum powder 70kg
[0065] The preparation method of the above-mentioned pressure-sensitive conductive adhesive composition is as follows:
[0066] , including the following...
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Abstract
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