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Pressure sensitive conductive adhesive composition and preparation method thereof

A composition, conductive adhesive technology, applied in conductive adhesives, adhesive additives, adhesive types, etc., can solve the problems of limiting the conductivity of the system and restricting the use of adhesives

Inactive Publication Date: 2012-01-25
NANTONG GAOMENG NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent CN1158745A provides a conductive adhesive, but it uses an acrylic system, and in the selection of conductive materials, alkali metal salts are used as inorganic conductive particles, which greatly limits the conductivity of the system and restricts the use of the adhesive in more Wide range of use

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] This embodiment 1 provides a pressure-sensitive conductive adhesive composition with a lower impedance value, which is a conductive pressure-sensitive adhesive composed of a pressure-sensitive adhesive and metal conductive particles. 30~80% of the total weight of the agent, wherein the composition (by weight percentage) of the pressure-sensitive adhesive is as follows:

[0015] Acrylic soft monomer 30-50%, acrylic hard monomer 5-20%, carboxyl-containing functional monomer 0.5-2.5%, hydroxyl-containing cross-linking monomer 0.5-2.5%, non-alcohol solvent 40-60% , Oil-soluble initiator 0.2-2.0%, mercaptan chain transfer agent 0.01-0.2%.

[0016] The acrylic soft monomer in the above-mentioned pressure-sensitive conductive adhesive composition includes: any one or any combination of ethyl acrylate, butyl acrylate, butyl methacrylate, ethylhexyl acrylate, and isooctyl acrylate. species composition.

[0017] The acrylic hard monomer includes any one or combination of any of...

Embodiment 2

[0030] An embodiment of the present invention provides a pressure-sensitive conductive adhesive composition with a lower impedance value, the pressure-sensitive conductive adhesive composition is mainly composed of a pressure-sensitive adhesive and metal conductive particles, wherein the pressure-sensitive adhesive The composition and weight percentage are as follows:

[0031] Pressure Sensitive Resin Raw Material Weight

[0032] Isooctyl acrylate (EHA) 220kg

[0033] Ethyl acrylate (EA) 150kg

[0034] Methyl methacrylate (MMA) 130kg

[0035] Acrylic acid (AA) 10kg

[0036] Hydroxyethyl Acrylate (HEA) 15kg

[0037] Hydroxypropyl Acrylate (HPA) 5kg

[0038] Benzoyl peroxide (BPO) 9kg

[0039] Ethyl acetate 320kg

[0040] Toluene 140kg

[0041] Dodecanethiol 11kg

[0042] Conductive particle raw material weight

[0043] Copper powder 150kg

[0044] Silver-plated copper powder 50kg

[0045] The preparation method of above-mentioned pressure-sensitive conductive adhesi...

Embodiment 3

[0050] Embodiment 3 of the present invention provides a pressure-sensitive conductive adhesive composition with a lower impedance value. The pressure-sensitive conductive adhesive composition is mainly composed of a pressure-sensitive adhesive and metal conductive particles, wherein the pressure-sensitive adhesive The composition and weight percentage of agent are as follows:

[0051] raw material weight

[0052] Butyl acrylate 380kg

[0053] Methyl acrylate 70kg

[0054] Methyl methacrylate 50kg

[0055] Acrylic 10kg

[0056] Methacrylic acid 5kg

[0057] Hydroxyethyl Acrylate 20kg

[0058] Benzoyl Peroxide 10kg

[0059] Ethyl acetate 204kg

[0060] Toluene 250kg

[0061] Dodecanethiol 1kg

[0062] Conductive particle raw material weight

[0063] Silver-plated aluminum powder 70kg

[0064] Grinding fiber 180kg

[0065] The preparation method of the above-mentioned pressure-sensitive conductive adhesive composition is as follows:

[0066] , including the following...

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Abstract

The invention discloses a pressure sensitive conductive adhesive composite and a preparation method thereof, belonging to the adhesive field. The composite comprises pressure sensitive adhesive and metal conductive particles, wherein, the metal conductive particles account for 30-80% of the total weight of the pressure sensitive adhesive; the pressure sensitive adhesive comprises the following components in percentage by weight: 30-50% of crylic acid soft monomer, 5-20% of crylic acid hard monomer, 0.5-2.5% of functional monomer containing carboxyl, 0.5-2.5% of cross linking monomer containing carboxyl, 40-60% of non alcohols solvent, 0.2-2.0% of oil soluble initiator and 0.01-0.2% of mercaptan chain transfer agent. The preparation method comprises the following steps: firstly preparing pressure sensitive adhesive, adding metal conductive particles into the prepared pressure sensitive adhesive to obtain the composite. In the invention, the pure crylic acid system is adopted to be matched with the high-low glass state temperature monomer to adjust the distribution of proper molecular weight and molecular weight to obtain the pressure sensitive adhesive with high initial viscidity and high hold viscidity and low-impedance composite adhesive.

Description

technical field [0001] The invention belongs to the technical field of polymer adhesives, in particular to a pressure-sensitive conductive adhesive composition and a preparation method thereof. Background technique [0002] The development of domestic conductive adhesives has started with the development of conductive polymers, but the substrates are mainly concentrated in epoxy, polyester and rubber structures, and the development of conductive pressure-sensitive adhesives in acrylic systems is relatively small. Patent CN1158745A provides a conductive adhesive, but it uses an acrylic system, and in the selection of conductive materials, alkali metal salts are used as inorganic conductive particles, which greatly limits the conductivity of the system and restricts the use of the adhesive in more Wide range of use. Contents of the invention [0003] The embodiments of the present invention provide a pressure-sensitive conductive adhesive composition and a preparation metho...

Claims

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Application Information

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IPC IPC(8): C09J133/06C09J11/04C09J9/02
Inventor 李岗沈峰邓煜东
Owner NANTONG GAOMENG NEW MATERIAL