A novel thermal insulation composite material and its preparation method

An insulating composite material, a new type of technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of reduced LED life, reduced thermal conductivity, and low thermal conductivity, and achieves great market competitiveness, improved mechanical strength, and thermal expansion. The effect of low coefficient
CN106531874BActive Publication Date: 2018-10-12南京劲峰洋光电科技有限公司
1 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
南京劲峰洋光电科技有限公司
Publication Date
2018-10-12

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention belongs to the technical field of a functional material, and relates to a novel heat dissipation insulating composite material and a preparation method therefor. Specifically, the novel heat dissipation insulating composite material consists of graphite, aluminum and ceramic, and adopts a sandwich structure, wherein a ceramic sheet layer is positioned in the middle, and graphite / aluminum composite sheet layers are positioned on the two sides; and the graphite / aluminum composite sheet layers consist of a graphite sheet layer with pores and aluminum for filling the pores. Integral forming of the graphite, metal aluminum and ceramic is realized by a high-pressure forging method to form the brand new composite material; the composite material has high thermal conduction, high insulativity and enhanced mechanical strength; and raw materials are low in coat, and the preparation method is simple and easy to implement, so that the composite material has high market competitiveness.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention belongs to the technical field of functional materials, and relates to a novel heat-dissipating and insulating composite material and a preparation method thereof. Background technique

[0002] For the development of semiconductor integrated circuit chips, LED lighting, IGBT and other fields, the problem of heat dissipation has plagued the industry for many years. As the chip integration becomes higher and higher, how to solve the heat dissipation problem becomes more and more prominent. Due to the constraints of space and chip size, it is destined to only adopt a passive cooling strategy, that is, after the heating body generates heat, the heat is effectively and quickly taken away by using materials with better heat dissipation performance to ensure that the chip can withstand the upper limit of the temperature. work normally within.

[0003] As far as the LED lighting industry is concerned, the current development trend is high-power...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More