Flexible circuit board manufacturing method
A technology of flexible circuit boards and manufacturing methods, which is applied in the direction of printed circuit manufacturing, printed circuits, electrical components, etc., can solve problems such as uneven surface of circuit boards, stripping of conductive lines, unfavorable surface packaging, etc., to achieve smooth surface and increase contact area, increase the effect of adhesion
Active Publication Date: 2019-06-11
AVARY HLDG (SHENZHEN) CO LTD +2
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Problems solved by technology
With the development of the conductive circuit toward the direction of refinement, the contact area between the conductive circuit and the substrate gradually becomes smaller, so that the conductive circuit is easily peeled off from the substrate, thereby causing a short circuit
In addition, if Figure 11 As shown, when the cover film 70 is formed on the conductive circuit 61, because the adhesive layer 71 of the cover film 70 fills the gap between the conductive circuits 61 due to pressing, the surface of the circuit board after pressing is uneven. , is not conducive to subsequent surface mount
Method used
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[0036] The method for manufacturing a flexible circuit board provided by the present invention will be described in detail below in conjunction with specific embodiments.
[0037] The flexible circuit board manufacturing method provided by the embodiment of the present invention includes the steps of:
[0038] For a first step, see figure 1 , providing a substrate 10 .
[0039] The base 10 includes a first surface 11 and a second surface 12 opposite to each other. The substrate 10 can be conductive metal materials such as copper, aluminum, silver, etc. In this embodiment, the substrate 10 is pure copper.
[0040] In the second step, see figure 2 , forming a photosensitive resin 21 on the substrate 10 .
[0041] In this embodiment, the photosensitive resin 21 is formed on the first surface 11 of the substrate 10 by vacuum bonding. The base 10 can be removed from the photosensitive resin 21 . In this embodiment, while a photosensitive resin 21 is formed on the first sur...
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The invention relates to a flexible circuit board production method. The method comprises the steps of forming a photosensitive resin on a removable substrate, selectively removing parts of the photosensitive resin to form a plurality of grooves with the substrate partially exposed in the grooves, filling conductive metal in the grooves to form conductor circuits, making the conductor circuit surface aligned to the photosensitive resin surface, removing the substrate to acquire the flexible circuit board with the conductor circuit embedded in the photosensitive resin.
Description
technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing a flexible circuit board. Background technique [0002] At present, among the circuit board manufacturing methods commonly used in the field of circuit board manufacturing, such as Figure 10 As shown, after the circuit fabrication is completed, the conductive circuit 61 is protruded on the substrate 62, and the adhesion between the conductive circuit 61 and the substrate 62 only depends on the bonding between the surface 611 of the conductive circuit 61 and the substrate 62 in contact with the substrate 62. force. With the development of the conductive circuit toward the finer direction, the contact area between the conductive circuit and the substrate gradually becomes smaller, so that the conductive circuit is easily peeled off from the substrate, thereby causing a short circuit. In addition, if Figure 11 As shown, when the cover film 70...
Claims
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IPC IPC(8): H05K3/00H05K3/10
CPCH05K3/0023H05K3/10H05K2203/0537
Inventor 李艳禄卢志高
Owner AVARY HLDG (SHENZHEN) CO LTD