Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Platformized embedded intelligent instrument system

An instrumentation and embedded technology, applied in the field of embedded intelligent instrumentation system

Inactive Publication Date: 2017-04-19
HANDAN COLLEGE
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, my country's smart instrument industry is still in its infancy, and there is still a big gap between instrument products and similar products in developed countries.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Platformized embedded intelligent instrument system
  • Platformized embedded intelligent instrument system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0023] see figure 1 and figure 2 , the present invention provides a technical solution: a platform-based embedded intelligent instrumentation system, including an intelligent instrumentation platform 1 and a data acquisition base station 2, and the communication link between the intelligent instrumentation platform 1 and the data acquisition base station 2 The data analysis and processing module 3 is connected with the data storage module 41, and the intelligent instrumentation platform 1 includes an upper layer application software module 4, and the input end of the upper layer application software module 4 is connected with a bottom drive module 5, and the upper layer application software module 4 The output end of the data acquisition module 7 is connected with an interface configuration module 6; the data acquisition base station 2 includes a data acquisition module 7, the output end of the data acquisition module 7 is connected with an interactive database 24, and the in...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses a platformized embedded intelligent instrument system, which comprises an intelligent instrument platform and a data acquisition base station. A communication link between the intelligent instrument platform and the data acquisition base station is connected with a data analyzing and processing module through a data storage module. The intelligent instrument platform comprises an upper-layer application software module. The data acquisition base station comprises a data acquisition module. The output end of the data acquisition module is connected with an interactive database. The data analyzing and processing module comprises a signal interaction module. The output end of the signal interaction module is connected with a microprocessor and a man-machine interface device. The data exchange is conducted between the microprocessor and the intelligent instrument platform. The data exchange is conducted between the man-machine interface device and the data acquisition base station. Therefore, a large amount of cumbersome hardwares are replaced by the above structure, and the internal structure and the man-machine interface of the system are greatly improved. Meanwhile, the use efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of intelligent instrumentation communication, in particular to a platform-based embedded intelligent instrumentation system. Background technique [0002] The advancement of computer technology and microprocessor technology has injected new vitality into the development of intelligent instruments. Through its built-in microprocessor, smart instruments can achieve many functions that traditional instruments cannot. Its application scope also widely involves many high-tech fields such as aerospace, environmental detection, and industrial production automatic control. In foreign countries, highly intelligent, multi-functional and comprehensively applied intelligent instruments and meters are becoming more and more common, with increasingly enhanced functions and a high level of intelligence. Some intelligent instruments and meters even have advanced intelligence such as expert systems and inferences, analysis ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G05B19/042
CPCG05B19/0423G05B2219/24215
Inventor 王旭辉王浩翔郭红俊张志来姜韶军
Owner HANDAN COLLEGE
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com