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Wafer Defect Measurement Device

A wafer and defect technology, applied in the field of devices for measuring wafer defects, can solve the problems of wafer contamination, measurement error and the like

Active Publication Date: 2019-07-09
LG SILTRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] However, in such an apparatus for measuring wafer defects according to the prior art, since the side surface or the lower surface of the wafer is supported, contamination may occur on the side surface or the lower surface of the wafer, and may occur during inspection of wafer defects. Measurement error

Method used

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  • Wafer Defect Measurement Device
  • Wafer Defect Measurement Device
  • Wafer Defect Measurement Device

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Embodiment Construction

[0023] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The scope of the present invention can be determined by the disclosure of the embodiments, and the concept of the embodiments includes modifications such as adding, removing, and changing elements.

[0024] Figure 1 to Figure 3 is a perspective view showing an apparatus for measuring wafer defects according to an embodiment of the present invention.

[0025] like Figure 1 to Figure 3 As shown, the apparatus for measuring wafer defects according to the embodiment of the present invention includes: an upper blower 120 and a lower blower 110 for spraying air onto the upper and lower surfaces of the wafer W; an upper contamination measuring part 130, a lower contamination measuring part 140 and The side contamination measuring parts 151 and 152 are used to detect the contamination of the upper surface, the lower surface and the side surface of the wafer W; the vertical move...

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Abstract

The device for measuring wafer defects includes a lower blower configured to inject air to a lower surface of a wafer to float the wafer; an upper blower provided to be moved up and down with respect to the lower blower and configured to inject the air to an upper surface of the wafer to fix the wafer; an upper contamination measuring part provided at an upper side of the upper blower and configured to detect contamination on the upper surface of the wafer; a lower contamination measuring part provided at a lower side of the lower blower and configured to detect contamination on the lower surface of the wafer; and a side contamination measuring part provided between the upper and lower blowers and configured to detect contamination on a side surface of the wafer.

Description

technical field [0001] The present invention relates to an apparatus for measuring wafer defects which prevents contamination caused by contact of the wafer and also measures defects on the upper surface, lower surface and side surfaces of the wafer. Background technique [0002] Wafers typically undergo multiple processing passes, and defects such as contamination, cracks, and scratches may develop during the operation of each pass. [0003] Since defects generated on the wafer surface may have adverse effects, such as generation of defects in device processing and reduction in yield, various wafer inspections are performed during the wafer manufacturing process. [0004] In a related art, wafers are inspected visually for defects. However, since visual inspection is less reliable and wafer defects may otherwise be generated, wafer defects are automatically inspected by a separate device. [0005] Korean Patent Publication No. 2010-0042340 discloses an apparatus for inspe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/95H01L21/66
CPCG01N21/9501G01N21/9503G01N21/9505H01L22/12H01L21/67288G01N21/94G06T7/0004G06T2207/30148H04N7/181
Inventor 姜憄勋韩基润
Owner LG SILTRON