Temperature control method and device for earphone assembly

A temperature control method and temperature control technology, applied in the field of electronics, can solve problems such as temperature rise, sound distortion of earphone components, affecting the sound quality of earphone components, etc., so as to avoid the influence of sound quality and avoid excessive temperature.

Active Publication Date: 2019-04-26
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The headphone assembly will generate heat during work, causing its temperature to rise. When the temperature is high, the headphone assembly is prone to failures such as crosstalk, noise, and sound distortion, which will affect the sound quality of the earphone assembly.

Method used

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  • Temperature control method and device for earphone assembly
  • Temperature control method and device for earphone assembly
  • Temperature control method and device for earphone assembly

Examples

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Embodiment Construction

[0068] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present disclosure as recited in the appended claims.

[0069] At present, almost every terminal (such as a mobile phone) is equipped with an earphone, and the terminal is provided with an earphone assembly matched with the earphone. The earphone has certain temperature requirements, so the temperature of the earphone assembly needs to be controlled. The method for controlling the temperature of an earphone assembly provided by an embodimen...

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Abstract

The invention relates to an earphone assembly temperature control method and device and belongs to the electronic technology field. The method comprises steps that in a work process of an earphone assembly of a terminal, measurement temperature detected by a first temperature sensor of the terminal is acquired, and a distance between the first terminal sensor and the earphone assembly is smaller than a preset distance; temperature control on the earphone assembly is carried out according to the measurement temperature to reduce temperature of the earphone assembly. The method is advantaged in that a problem that timbre of the earphone assembly is influenced by relatively high temperature of the earphone assembly is solved, and influence on timbre of the earphone assembly is avoided. The earphone assembly temperature control method is applied to temperature control on the earphone assembly.

Description

technical field [0001] The present disclosure relates to the field of electronic technology, in particular to a method and device for controlling the temperature of an earphone assembly. Background technique [0002] With the development of electronic technology, terminals such as smart phones and tablet computers based on electronic technology are more and more widely used in daily life. [0003] The terminal usually includes an earphone assembly, and the earphone assembly is provided with an earphone jack. The user can insert the earphone into the earphone jack, connect the earphone to the earphone assembly, and listen to the sound from the terminal through the earphone and the earphone assembly. For example, the user can listen to the sound through the earphone and the earphone assembly. The song played by the terminal, or, when the terminal is a mobile phone, the user can listen to the other user's voice through the earphone and the earphone assembly. [0004] During th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05D23/20H04R1/10
CPCG05D23/20H04R1/1041H04R2201/105
Inventor 杨晓星
Owner BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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