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One-time molding method of large-angle regular triangular pyramid-shaped indenter based on fib

A forming method, technology of regular triangular pyramids, applied in the field of processing regular triangular pyramid-shaped indenters by using focused ion beam milling technology, to achieve the effects of high repeatability, small surface roughness, and high cone angle precision

Active Publication Date: 2018-08-10
咸阳瞪羚谷新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The problem solved by the invention is: Aiming at the problem that the large-angle regular triangular pyramid-shaped indenter cannot directly use the rotation and tilting methods to directly realize the one-time processing and forming of the indenter, by increasing the inclined table, the angle to be tilted is reduced, and the rotation-symmetrical processing is used. Combined with tilting processing to realize one-time processing and forming of large-angle regular triangular pyramid indenter

Method used

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  • One-time molding method of large-angle regular triangular pyramid-shaped indenter based on fib
  • One-time molding method of large-angle regular triangular pyramid-shaped indenter based on fib
  • One-time molding method of large-angle regular triangular pyramid-shaped indenter based on fib

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Embodiment Construction

[0040] Referring to the accompanying drawings, where, figure 2 (a) is the schematic diagram of the regular triangular pyramid on the platform surface, O, A, B, C are the four vertices of the regular triangular pyramid, OAB, OAC, OBC are the faces to be processed, OH is the height of the regular triangular pyramid, β is the height of OH and the surface The formed line angle, γ is the angle formed by the high OH and the edge, and α is the angle formed between the edge and the edge; figure 2 (b) is a schematic diagram of a regular triangular prism on an inclined table, OR is parallel or coincident with the rotation axis R′R″ of the test bench, RN 1 Perpendicular to face OAB, OR to face RR 1 R 2 Vertical, ∠RON 1 is the line-surface angle β between OR and surface OAB Ra , ∠ROP″ is the line-surface angle β between OR and surface OBC Rc ,∠R 1 RR 2 Compensation angle determined for the lower base of the ramp. In the machining of the inclined table, firstly, the plane OPC (th...

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Abstract

The invention belongs to the technical field of micro-nano machining of complicated micro-nano structures and devices, and relates to a micro machining technology based on focused ion beam (FIB). In the method, the FIB is applied to machining of a normal-triple-prism-shaped pressure head, and normal-triple-prism-shaped pressure head blanks of different angles can be machined by the milling function of the FIB in conjunction with an FIB double-beam system and a sample experiment table inside which high-accuracy inclination and rotation can be realized. The large-angle normal-triple-prism-shaped pressure head can be machined by adjusting machining parameters of the FIB and the relative position of a sample table. Compared with the conventional pressure head machining way, the method has the advantages of high machining accuracy, high repeatability, realization of one-step molding, and avoidance of errors caused by repeated assembly and manual operation in a machining process.

Description

technical field [0001] The invention relates to the technical field of micro-nano processing of complex nanostructures, in particular to a method for processing regular triangular pyramid-shaped indenters using focused ion beam milling technology, which can be popularized for use in micro-nano pyramids such as Berkovich indenters required for nano-indentation hardness testing experiments Head preparation. Background technique [0002] Focused Ion Beam (FIB for short) is a rapidly developing micro-nano manufacturing technology. It has the advantages of high precision and good flexibility. Its minimum beam spot can be controlled at about 10nm, which can realize high-precision etching processing at specified positions . In recent years, it has been continuously used in TEM sample preparation, micro-nano device processing and micro-tool manufacturing. With the continuous in-depth development of focused ion beam, it has become one of the most promising micro-nano processing tec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C99/00
CPCB81C99/0015
Inventor 单智伟张展铭刘飞
Owner 咸阳瞪羚谷新材料科技有限公司
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