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A thin film patterning method

A thin-film graphics and graphics technology, applied in the direction of instruments, optics, electrical components, etc., can solve the problems of easy deposition of thin films, increased production costs, and difficult cleaning of thin films, and achieve the effect of reducing production costs and increasing production costs

Active Publication Date: 2019-09-13
WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a thin film patterning method to solve the problem that in the existing thin film patterning method, due to the gap between the metal mask and the substrate, the thin film is easily deposited on the non-thin film deposition area, thereby affecting the subsequent process, and The thin film on the metal mask plate is not easy to clean, which in turn causes the metal mask plate to be scrapped and raises the technical problem of production cost

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Embodiment Construction

[0035] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.

[0036] The treatment method of the present invention can be widely used in various fields, and can utilize many suitable materials to make, and below is to illustrate by preferred embodiment, certainly the present invention is not limited to this specific embodiment, this field Common replacements known to those skilled in the art undoubtedly fall within the protection scope of the present invention.

[0037] refer to figure 1 , figure 1 It is a process flow diagram of a preferred embodiment of the film patterning method of the present invention;

[0038] Such as figure 1 As shown, the film patterning method of this preferred embodiment includes:

[0039] Step S101, providing a substrate, the substrate includes a film deposition area and a...

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Abstract

The invention provides a thin film patterning method which comprises the following steps: providing a substrate which comprises a thin film stacking region and a non thin film stacking region; forming a strippable adhesive layer on the non thin film stacking region; solidifying the strippable adhesive layer; forming a thin film on each of the strippable adhesive layer and the thin film stacking region; removing the strippable adhesive layer and the thin film on the strippable adhesive layer. According to the thin film patterning method, a strippable adhesive is adopted to replace a metal mask plate; the strippable adhesive is firstly formed on the non thin film stacking region, then thin film deposition is carried out, and finally the strippable adhesive is removed, thus forming a patterned thin film; therefore, the whole patterning steps cannot affect the subsequent procedure; furthermore, the strippable adhesive is used for replacing the metal mask plate, and the production cost is reduced.

Description

technical field [0001] The invention relates to the field of liquid crystal display panels, in particular to a film patterning method. Background technique [0002] In the manufacturing process of liquid crystal display panels, it is often necessary to form a film with a certain pattern, and this process is called patterning of the film. [0003] There are many existing thin film patterning methods, among which, the method of using a metal mask to directly deposit a patterned thin film on a substrate has been widely used. This method includes: first, sticking A metal mask is combined, then film deposition is performed, and finally the metal mask is removed to form a patterned film. However, due to the unavoidable gap between the metal mask and the substrate, it is easy to form a thin film on the non-film accumulation area when the thin film is deposited by gas deposition, thereby affecting the subsequent process, and the thin film on the metal mask is not easy to clean. Th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13H01L21/78
Inventor 陈永胜
Owner WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD