A waste printed circuit board non-metallic powder loaded silica hybrid filler and its preparation method and application

A technology of non-metallic powder and silica, which is applied in the field of waste printed circuit board non-metallic powder-loaded silica hybrid filler and its preparation, can solve the problems of poor interface bonding and deterioration of composite material performance, and achieve improved performance, The effect of hindering the growth and extension of cracks and expanding the application range

Active Publication Date: 2019-08-20
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the shortcomings of poor interface bonding between non-metallic powder of waste printed circuit boards and composite material matrix, which deteriorates the performance of composite materials, and provide a non-metallic powder-loaded silicon dioxide hybrid filler for waste printed circuit boards and its preparation method and applications, in order to improve the mechanical properties and thermal stability of composite materials by loading a layer of irregular nano-silica particles, and realize the large-scale application of non-metallic powder of waste printed circuit boards in composite materials

Method used

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  • A waste printed circuit board non-metallic powder loaded silica hybrid filler and its preparation method and application
  • A waste printed circuit board non-metallic powder loaded silica hybrid filler and its preparation method and application
  • A waste printed circuit board non-metallic powder loaded silica hybrid filler and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Disperse 5g of crushed and dried non-metallic powder of waste printed circuit boards into 100ml of absolute ethanol, add 3.0g of 25wt% ammonia water and 8.0g of deionized water, then dropwise add 0.2ml of dibutyltin dilaurate, at 30°C Ultrasonic dispersion for 10 minutes, at 55°C, 2.5g of tetraethyl orthosilicate was added dropwise, stirred and reacted for 2.5 hours, the product was centrifuged and washed with ethanol five times, and dried in a vacuum oven at 100°C for 10 hours to obtain WPCBP-SiO 2 Hybrid filler, that is, waste printed circuit board non-metallic powder loaded silica hybrid filler. Figure 1a , Figure 1b , Figure 1c SEM image of silica hybrid filler loaded on waste printed circuit board non-metallic powder. It can be seen from the figure that a layer of irregular nano-silica particles has grown on the surface of the waste printed circuit board non-metallic powder. Figure 1c It can be further seen that the silica particles are uniformly distributed ...

Embodiment 2

[0034] In a 250 ml three-neck flask, add 10 g of waste printed circuit board non-metallic powder, then add 150 ml of absolute ethanol, 5 ml of deionized water, 10 ml of 25 wt% ammonia water, ultrasonically disperse at 30 ° C for 0.5 hours, and then dropwise add 0.5 ml of dibutyltin dilaurate, and 8g of methyl orthosilicate was added dropwise, reacted at 30°C for 10 hours, centrifuged, washed 8 times with absolute ethanol, and dried in a vacuum oven at 60°C for 24 hours to obtain WPCBP- SiO 2 Hybrid packing. figure 2 is WPCBP-SiO 2 The thermogravimetric curve of the hybrid filler, it can be seen from the figure that the thermal stability of the waste printed circuit board non-metallic powder is significantly enhanced after the silica particles are loaded. image 3 is WPCBP and WPCBP-SiO 2 The infrared spectrum of the hybrid filler, it can be seen from the figure that the Si-O stretching vibration peaks have shifted significantly (from 1032cm -1 to 1092cm -1 ), the change ...

Embodiment 3

[0036] The WPCBP-SiO prepared in 20 g embodiment 1 2Add the hybrid filler to 100g of 191# o-phthalic unsaturated polyester resin, mix well with a three-roll mill, then add 1.0g of cobalt isooctanoate accelerator and 2.0g of methyl ethyl ketone peroxide curing agent at room temperature, and stir for 5 minutes respectively , after vacuum defoaming treatment, pour it into a polytetrafluoroethylene mold for room temperature curing for 4 hours, and then put it in a blast oven at 60°C for post-curing for 10 hours to obtain non-metallic powder of waste printed circuit boards modified by isocyanate-terminated prepolymers / Unsaturated polyester composite. Figure 4a , Figure 4b , Figure 4c , Figure 4d is the SEM image of the impact section added to the unsaturated polyester matrix, from Figure 4a , Figure 4b It can be seen that the WPCBP without silica is basically exposed in the unsaturated polyester, and the interfacial bonding between the polymer matrix and the polymer mat...

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Abstract

The invention discloses a waste printed-circuit-board nonmetallic powder loaded silicon dioxide hybrid filler and a preparation and application thereof. The method includes: firstly, dispersing waste printed-circuit-board nonmetallic powder into a solvent, and adding ammonia water and a catalyst; after ultrasonic dispersion, slowly adding a silicon source monomer, and performing stirring reaction under 30-80DEG C, centrifugal filtration, cleaning and drying to obtain the waste printed-circuit-board nonmetallic powder loaded silicon dioxide hybrid filler. The hybrid filler is added to unsaturated polyester resin to prepare composite materials good in mechanical property. Interface bonding of the waste printed-circuit-board nonmetallic powder and a polymer matrix can be effectively realized, and mechanical property and thermal stability of the composite materials can be obviously improved; profound significance is achieved for reclamation of waste filler and preparation of the novel hybrid filler is achieved.

Description

technical field [0001] The invention belongs to the fields of preparation of novel hybrid fillers and recycling of solid waste, and in particular relates to a non-metallic powder-loaded silicon dioxide hybrid filler for waste printed circuit boards, a preparation method and application thereof. Background technique [0002] With the continuous acceleration of the updating speed of electronic products, the disposal of waste printed circuit boards (WPCB) is also facing great challenges. At present, the recycling of WPCB is mainly concentrated in the precious metal part, while the non-metallic powder with a content of about 70% is mainly treated by incineration and landfill, which has caused serious environmental pollution and waste of resources. Adding waste printed circuit board non-metallic powder (WPCBP) as a reinforcing filler to the polymer matrix to prepare composite materials can not only effectively recycle WPCBP, reduce waste of resources, but also reduce the producti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L67/06C08K9/12C08K3/36
Inventor 贾志欣胡德超钟邦超李建林罗远芳贾德民
Owner SOUTH CHINA UNIV OF TECH
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