A composite and forming integrated device and method of a multi-layer metal microchannel structure

Abstract

The invention discloses an integrated device and method for compounding and forming a multi-layer metal microchannel structure, which solves the existing structural design problems such as complex mold device structure, complicated metal microchannel structure processing process and high manufacturing cost, single metal The technical problem that the quality of the microchannel structure formed by the material alone is poor and its own performance cannot be improved, including the supporting upper mold base and the lower mold base, the upper mold base can realize up and down reciprocating movement through the guide sleeve and the guide pillar; the upper mold base A punch is fixed on the lower surface, and a die is fixed on the upper surface of the lower die holder. The die is arranged on the upper surface of the lower die holder and forms a mold cavity with the die fixing plate. The upper surface of the die Micro-channel grooves are recessed inward; the punch is fixed on the lower surface of the upper die base through the punch fixing plate, and the upper surface of the punch is in contact with the upper die base. A groove is provided inwardly, and the groove The internal fixed connection is provided with a vibrator that runs through the upper mold base, and can be widely used in the field of precision manufacturing of bimetallic microchannel structures.

Description

technical field [0001] The invention belongs to the field of precision manufacturing of bimetallic microchannel structures, and in particular relates to an integrated device and method for compounding and forming a multilayer metal microchannel structure. Background technique [0002] With the continuous miniaturization of the structure of micro-miniature devices, the energy transport inside the device is limited by the tiny space, which makes high-power devices face the problem of high energy and rapid heat transport caused by excessive power. The problem of chip thermal control brought about by the temperature sensitivity of microelectronic devices has also been highlighted. The reliability of electronic devices is very sensitive to temperature. Any well-designed electronic device will fail or fail under the action of long-term overheating and uneven thermal stress. Generally, the operating temperature of electronic devices should be below 130°C. The famous 10°C rule poi...

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Problems solved by technology

[0004] Chinese patent document CN102411060A (patent application number 201110401804.9) discloses a microfluidic chip with a high aspect ratio microfluidic channel and its manufacturing method. The material is polydimethylsiloxane (PDMS), And it is made by soft lithography technology, and the male mold used in the casting of the microfluidic chip is processed by SU-8 maskless lithography. Although this technology has the advantages of high flexibility, low production cost and short cycle, its preparation The structure of the device is complex, the operation requirements are strict, and it is not suitable for the research of microchannels in the field of metal materials

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