Vacuum evaporation device
An evaporation and vacuum technology, applied in the direction of vacuum evaporation plating, sputtering plating, gaseous chemical plating, etc., can solve the problems of slow evaporation speed, low evaporation rate, and difficulty in forming mixed evaporation material gas, etc. Achieve the effect of increasing the evaporation speed and saving evaporation materials
Active Publication Date: 2017-05-17
TSINGHUA UNIV +1
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Problems solved by technology
Especially when there are two or more evaporation sources, it is more difficult to control the evaporation rate of each evaporation source, and it is difficult to form a predetermined ratio of mixed evaporation material gas
The larger the size of the coating, the more difficult it is to ensure the uniformity of the film formation, and because it is difficult to control the diffusion direction of the gaseous evaporation material atoms, most of the evaporation materials cannot be attached to the surface of the substrate to be coated, resulting in a low evaporation rate and Problems such as slow evaporation speed
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[0025] The vacuum evaporation device and the vacuum evaporation method of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0026] see figure 1 , The first embodiment of the present invention provides a vacuum evaporation device 10, including an evaporation source 100, a substrate to be coated 200, a vacuum chamber 300 and an electromagnetic wave signal input device 400, the evaporation source 100 and the substrate to be coated 200 are arranged in the vacuum chamber 300 middle. The substrate to be plated 200 is opposite to the evaporation source 100 and arranged at intervals, and the interval is preferably 1 micron to 10 mm. The electromagnetic wave signal input device 400 inputs an electromagnetic wave signal to the evaporation source 100 . In this embodiment, the electromagnetic wave signal input device 400 is also disposed in the vacuum chamber 300 .
[0027] see figure 2 and image 3 , the evaporation sou...
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Abstract
The invention provides a vacuum evaporation device which comprises an evaporation source, a to-be-evaporated substrate, a vacuum chamber and an electromagnetic wave signal input device. The evaporation source comprises an evaporation material and a carbon nano tube film structure which is a carrier. The evaporation material is arranged on the surface of the carbon nano tube film structure and borne through the carbon nano tube film structure. The evaporation source and the to-be-evaporated substrate are arranged in the vacuum chamber. The to-be-evaporated substrate and the carbon nano tube film structure of the evaporation source are oppositely arranged in a spaced mode. The electromagnetic wave signal input device can input an electromagnetic wave signal into the carbon nano tube film structure.
Description
technical field [0001] The invention relates to the field of vacuum evaporation, in particular to a vacuum evaporation device. Background technique [0002] Vacuum evaporation is a process in which the evaporation source is heated in a vacuum to vaporize the evaporation material and deposit a film on the surface of the substrate to be coated. In order to form a uniform film, it is necessary to form a uniform vapor deposition material around the substrate to be plated. In the prior art (such as Chinese patent application CN1970826A), it is usually necessary to set up a complicated flow guide device to uniformly transport the gaseous evaporation material to the surface of the substrate to be plated. Especially when there are two or more evaporation sources, it is more difficult to control the evaporation rate of each evaporation source, and it is difficult to form a predetermined ratio of mixed evaporation material gas. The larger the size of the coating, the more difficult ...
Claims
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Login to View More IPC IPC(8): C23C14/24
CPCC23C14/042C23C14/06C23C14/24C23C14/243C23C16/042C23C16/30C23C16/4485C23C14/0605C23C14/28
Inventor 魏洋魏浩明姜开利范守善
Owner TSINGHUA UNIV