A shielding device, shielding method and evaporation system
A technology of evaporation and evaporation source, which is applied in the directions of vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve the problems of poor repeatability stability, high cost of time accompanying, high cost of materials, etc., and achieve improved stability Improve performance and yield, achieve continuity control, and save evaporation materials
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Embodiment 1
[0034] This embodiment provides a shielding device, such as figure 1 As shown, it includes a power mechanism 1 and a shielding mechanism 2. The power mechanism 1 is used to drive the shielding mechanism 2 to change different positions in the evaporation rate control stage and the evaporation stage, and the shielding mechanism 2 is used to shield the evaporation source in the evaporation rate control stage. 3 and the evaporation channel between the substrate 4 to be coated, and keep the evaporation channel between the evaporation source 3 and the evaporation rate sensor 5 open; it is also used to open the evaporation source 3 and the substrate to be coated during the evaporation stage 4, and keep the evaporation channel between the evaporation source 3 and the evaporation rate sensor 5 open.
[0035] The blocking device can not only block the evaporation channel between the evaporation source 3 and the substrate to be coated 4 in the evaporation rate control stage, but also kee...
Embodiment 2
[0046] This embodiment provides a shielding device, which is different from Embodiment 1, such as Figure 5 As shown, the shielding part 21 is in the shape of a cylinder, and one end of the cylinder is used to face the evaporation surface 31 of the evaporation source 3. The diameter of the cylinder extends away from the power mechanism 1, and the diameter of the cylinder is greater than or equal to The diameter of the vapor deposition source 3 .
[0047] In this embodiment, the connecting plate 22 is parallel to the evaporation surface 31 of the evaporation source 3 , and the angle between the diameter of the cylindrical shielding portion 21 and the connecting plate 22 is greater than 90° and less than 180°. To ensure that when the shielding part 21 rotates to the shielding position in the vapor deposition rate control stage, it can just completely shield the vapor deposition channel between the vapor deposition source 3 and the substrate 4 to be coated, so as to avoid the rat...
Embodiment 3
[0053] This embodiment provides an evaporation system, including the shielding device in any one of Embodiments 1-2.
[0054] Wherein, the evaporation system also includes an evaporation source, an evaporation rate sensor and an evaporation film thickness controller, and the evaporation source is used for evaporating a film layer on the substrate to be coated. The evaporation rate sensor is used to collect the evaporation rate of the evaporation source, and send the collected evaporation rate to the evaporation film thickness controller. The evaporation film thickness controller is used to control the thickness of the film layer evaporated onto the substrate to be coated according to the evaporation rate. The control module of the shielding device is connected to the evaporation film thickness controller, and the evaporation film thickness controller is also used to control the control module to send a control command to the power mechanism.
[0055] By adopting the shielding...
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