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A movable anode device for vertical electroplating

An anode device, vertical electroplating technology, applied in the direction of electrodes, electrolysis process, electrolysis components, etc., can solve the problems of high consumption of light agent, poor uniform plating effect, etc., and achieve the effect of reducing cost, reducing consumption and good electroplating effect

Active Publication Date: 2018-07-27
DONGGUAN WERY DOOD CIRCUIT BOARD EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a movable anode device for vertical electroplating, the area of ​​which can be flexibly adjusted according to the size of the workpiece to be electroplated, so as to overcome the defects of poor uniformity of electroplating and high consumption of light agent in the prior art;

Method used

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  • A movable anode device for vertical electroplating

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Effect test

Embodiment 1

[0029] see figure 1 , this embodiment provides a movable anode device for vertical electroplating, which can realize the function of electrically adjusting the anode width, not only can flexibly adjust the anode width to match the size of the plated piece, but also can be electrically Adjustment, improve the convenience of operation and the accuracy of adjustment, and finally improve the electroplating effect.

[0030] The movable anode device of this embodiment mainly includes three components: an anode group, a width adjustment mechanism, and a first drive mechanism (not shown in the figure); wherein the width adjustment mechanism can be automatically aligned under the drive of the first drive mechanism. The width of the anode group is adjusted to achieve the purpose of adjusting the area of ​​the anode to match the plated piece.

[0031] Wherein, the anode group includes two anode units 1, and the anode units 1 can adopt conventional materials, shapes and sizes, and can be...

Embodiment 2

[0039] The movable anode device of this embodiment mainly includes two components: an anode group and a width adjustment mechanism; the width adjustment mechanism can manually adjust the width of the anode group to achieve the adjustment of the anode area to the same size as the plated piece. matching purpose.

[0040] Wherein, the anode group includes two anode units 1, and the anode units 1 can adopt conventional materials, shapes and sizes, and can be selected according to actual needs, which is not limited here.

[0041] The width adjusting mechanism includes a slide rail mounting plate 2, two anode mounting plates 4, and a variable speed transmission mechanism. A linear slide rail 3 is installed horizontally on the slide rail mounting plate 2, and two anode mounting plates 4 are respectively slidably mounted on the linear slide rail 3 and distributed on the left and right sides thereof, and the bottom of each anode mounting plate 4 can be An anode unit 1 is detachably in...

Embodiment 3

[0046] In addition to the area difference between the anode and the plated piece, the factors that have a greater impact on the uniformity of electroplating also have the relative height of the anode and the plated piece. Therefore, in order to further improve the electroplating effect, the third embodiment is based on the first embodiment Improvements are made to provide a movable anode device for vertical electroplating, which can realize the function of electrically adjusting the width and height of the anode at the same time.

[0047] The movable anode device of this embodiment includes an anode group, a width adjustment mechanism, and a first drive mechanism, and also includes a height adjustment mechanism (not shown in the figure) and a second drive mechanism (not shown in the figure); the width adjustment mechanism wherein , the width of the anode group can be automatically adjusted under the driving of the first driving mechanism to achieve the purpose of adjusting the ...

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Abstract

The invention discloses a movable anode assembly used for vertical electroplating. The movable anode assembly comprises an anode set and a width adjusting mechanism. The anode set comprises two anode units. The width adjusting mechanism comprises a sliding rail mounting plate, two anode mounting plates and a speed change transmission mechanism. A linear sliding rail is horizontally installed on the sliding rail mounting plate, and the two anode mounting plates are slidingly installed on the left side and the right side of the linear sliding rail correspondingly. Each anode unit is detachably installed on the corresponding anode mounting plate. The speed change transmission mechanism is fixedly connected with the two anode mounting plates. Under the effect of the speed change transmission mechanism, the two anode mounting plates slide end to end or head to head along the linear sliding rail, and thus the two anode units are driven to move end to end or head to head. According to the embodiment of the movable anode assembly used for vertical electroplating, the area and the height of the anode set are adjusted according to the sizes of different plating parts so as to enable the area and the height of the anode set and plating parts to be kept at optimal value, so that it is ensured that a good electroplating effect can be obtained, luminescence agent volatilization is effectively controlled, consumption is reduced, and cost is lowered.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a movable anode device for vertical electroplating. Background technique [0002] Electroplating is an important process in the production process of PCB boards. It is the process of depositing and forming coatings on the substrate by electrolysis. Usually, during electroplating, the coating metal is used as the anode, which is oxidized into cations and enters the electroplating solution. The PCB board to be plated is then At the cathode, the cations of the plated metal are reduced to form a plated layer on the surface of the PCB. [0003] At present, in the production process of PCB boards, there are mainly two ways of electroplating: vertical electroplating and horizontal electroplating. Most of the circuit board manufacturers mainly use vertical electroplating. Since the key to PCB electroplating is how to ensure the uniformity of the thickness of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/12C25D21/12
CPCC25D17/12C25D21/12
Inventor 杨毅吴龙安蔡志浩
Owner DONGGUAN WERY DOOD CIRCUIT BOARD EQUIP