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119 results about "Head to head" patented technology

Preparation method for polymethyl methacrylate (PMMA) resin with high thermal stability

ActiveCN102336864AHigh thermal degradation resistanceImprove thermal stabilityCross-linkPolymer science
The invention provides a preparation method for a methyl methacrylate polymer with high thermal stability, and continuous bulk polymerization or solution polymerization is adopted in the invention. According to the invention, no free radical scavengers or cross-linking agents need to be added in the preparation method; instead, unstable structures like a head-to-head structure and a terminal unsaturated double bond in the molecular structure of the methyl methacrylate polymer is gradually eliminated by controlling polymerization temperature, devolatilization temperature, polymerization time and devolatilization time in the continuous polymerization process of methyl methacrylate, thereby achieving the goal of improving thermal stability of PMMA. Preparing a PMMA resin with the method not only enables the PMMA resin to have excellent thermal degradation resistance, but also enables other inherent excellent properties of the PMMA resin to be guaranteed. The methyl methacrylate polymer prepared by the method in the invention has high thermal degradation resistance, with a starting thermal degradation temperature being higher than 360 DEG C. With utilization of the method, light transmittance of the PMMA resin is guaranteed to be 93%, and molecular weight distribution of the PMMA resin is guaranteed to be less than 1.8, while thermal stability of the PMMA resin is improved.
Owner:CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI

Card edge connector assembly with ejectors for linear installation/ejection and the associated printed circuit board for use therewith

A DIMM connection system includes a pair of non-vertical DIMM first and second connectors (10, 12) head to head positioned on a printed circuit board (100). Each of the connectors (10, 12) including an insulative housing (14) defining a central slots (16) for receiving the card therein. Two rows of pairs of contacts (18) are positioned within the housing (14) by two sides of the central slot (16) for engagement with the card. A pair of ejectors (20) are disposed at two opposite ends of the housing (14) for ejecting the inserted card. The key (24) in the slot of the first connector (10) is aligned with that of the second connector (12) in a transverse direction. The pair of contacts (18) of the first connector (10) are aligned with the corresponding pair of contacts (18) of the second connector (12) in the same transverse direction. A printed circuit board (100) is positioned under the pair of connectors (10, 12), and includes four rows of conductive pads (102) thereon corresponding to the contacts (18) of the first and the second connectors (10, 12) wherein for each set including four conductive pads (102) respectively in the four rows and aligned with one another in the same transverse direction, the first conductive pad (102) is electrically connected to the third conductive pad (102) while the second conductive pad (102) is electrically connected to the fourth conductive pad (102) so that both the connectors (10, 12) share the same circuits on the printed circuit board (100).
Owner:HON HAI PRECISION IND CO LTD
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