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Packaging method of image sensor chip

A technology of image sensor and packaging method, applied in the field of image sensor, capable of solving problems such as complex structure

Active Publication Date: 2021-05-11
GALAXYCORE SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The structure of the above photosensitive element mobile optical image stabilization method is relatively complex, and multiple mechanical structures need to cooperate in the image sensor module

Method used

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  • Packaging method of image sensor chip
  • Packaging method of image sensor chip
  • Packaging method of image sensor chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] First, execute step S1, refer to Figure 2a , providing a support substrate 10, the support substrate 10 is a transparent substrate, such as a glass substrate. refer to Figure 2b As shown, a first patterned photoresist 11 is formed on the surface of the transparent substrate 10, and the first patterned photoresist 11 covers the edge of the support substrate 10. In this embodiment, processes such as gluing, exposure, and development are used. A first patterned photoresist 11 is formed. Etching the supporting substrate 10 with the first patterned photoresist 11 as a mask to form a first groove 21 in the supporting substrate 10, refer to Figure 2c As shown, the first groove 21 is used for bonding the image sensor chip, so that the width of the first groove 21 is 5.0mm˜10.0mm. Afterwards, the first patterned photoresist 11 is removed. In this embodiment, the first patterned photoresist 11 may be removed by, for example, a plasma ashing process or an organic solution we...

Embodiment 2

[0069] The difference from Embodiment 1 is that the side of the metal wire away from the image sensor chip does not have an extension, after removing the support substrate, the image sensor chip is brought into contact with a driving component, and the driving component is used to support and drive the The image sensor chip is moved, and the image sensor chip is electrically connected to the external circuit board through the driving component.

[0070] Specifically, refer to Figure 4a As shown, the metal wire 70' includes a seed layer 50' and a metal layer 60', and the side of the metal wire 70' close to the image sensor chip 40 has an elastic structure 71'. After that, refer to Figure 4bAs shown, an upper substrate 80' is provided, the upper substrate 80' is bonded to the image sensor 40 through a metal wire 70', and a cleaning solution is used to remove the temporary bonding glue, and at the same time, the supporting substrate is removed to form a package. This process s...

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Abstract

The invention relates to a packaging method for an image sensor chip, comprising: providing a supporting substrate, bonding the image sensor chip to the supporting substrate; forming metal wires on the image sensor chip; providing an upper substrate, and bonding the image The sensor chip and the upper substrate are assembled as one, and the inner side of the metal wire close to the image sensor chip has an elastic structure; the support substrate is removed to form a package; the package can move in the horizontal direction, thereby realizing the optical sensor of the image sensor chip Anti-shake function.

Description

technical field [0001] The invention relates to the technical field of image sensors, in particular to a packaging method for an image sensor chip. Background technique [0002] Existing portable mobile devices are generally integrated with a miniature image acquisition device for simply and quickly realizing the camera function. When a mobile device is held in hand to take a picture of an object, an important reason affecting the quality of image shooting is the shake generated by the hand-held manner. Optical image stabilization relies on special lenses or photosensitive elements to minimize image instability caused by shaking during operator use. Optical anti-shake technology is that the gyroscope in the lens detects a small movement, and sends the signal to the microprocessor to immediately calculate the displacement that needs to be compensated, and then compensate the lens group or move the photosensitive element, according to the shaking direction and displacement T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146H04N5/225
CPCH01L27/14601H01L27/14636H01L27/14683H04N23/54
Inventor 赵立新
Owner GALAXYCORE SHANGHAI