Selection of electroplating equipment and its selection of electroplating molds
A technology for selecting electroplating and molds, which is applied in the field of selecting electroplating equipment and selecting electroplating molds, can solve the problems of tensile damage to the material strip 100b, decline in electroplating yield, and decline in yield, so as to increase the life of the mold, improve the yield, The effect of improving electroplating efficiency
Active Publication Date: 2018-12-21
东莞奥美特科技有限公司
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Problems solved by technology
In the electroplating process, in order to make the strip close to the selective electroplating mold 30b, it is usually necessary to increase the pressure to feed the strip 100b through the pressing mechanism 40b. However, as the pressure increases, the friction between the strip 100b and the selective electroplating mold 30b is also corresponding increase, it is easy to cause the strip 100b to be damaged by tension, and then lead to the problem of a decrease in the electroplating yield
In addition, due to the increase of pressure, the selective electroplating mold 30b is easily deformed, which will also lead to the problem of decreased yield
Method used
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[0057] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described in detail with reference to the accompanying drawings. In describing the selection of electroplating equipment in the present invention, it should be understood that terms such as "front", "rear", "upper", "lower", "left", "right", "front", "rear" are used only for the purpose of It is convenient to describe the technical solution of the present invention, but does not indicate that the referred device or element must have a specific orientation, so it should not be construed as a limitation of the present invention.
[0058] figure 1 The selective electroplating equipment 1 in some embodiments of the present invention is shown, and the selective electroplating equipment 1 can be used for electroplating such as integrated circuit lead frame strips, and is especially suitable...
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The invention discloses selective plating equipment and a selective plating die thereof. The selective plating die comprises a roller-shaped die body, and the roller-shaped die body is provided with plating holes; and the selective plating die furthermore comprises a linkage mechanism connected with the die body, and the linkage mechanism is used for linking the die body with a drive mechanism so that the die body can rotate around the center axis of the die body along with the drive mechanism. By the implementation of the selective plating equipment and the selective plating die thereof, due to the fact that the selective plating die is provided with the linkage mechanism connected with the drive mechanism, the selective plating die can rotate initiatively under the drive of the drive mechanism, plating efficiency can be improved, the plating yield is raised, the service life of the die is prolonged, and an adjustment process of the plating die is simplified.
Description
technical field [0001] The invention relates to the field of electroplating, in particular to selective electroplating equipment and a selective electroplating mold. Background technique [0002] Figure 15 Shows a schematic diagram of the structure of selective electroplating equipment in the related art. The selective electroplating equipment can be used for silver plating, gold plating, or nickel plating of integrated circuit lead frame strips, and it can include a frame 10b and a selection device installed on the frame 10b. The electroplating mold carrying mechanism 20b, the selective electroplating mold 30b arranged in the selective electroplating mold carrying mechanism 20b, the pressing mechanism 40b for pressing the material strip 100b, and the liquid spraying mechanism 50b arranged in the middle of the selective electroplating mold 30b. The selective electroplating mold 30b can be a roller-type selective electroplating mold disclosed in Chinese Patent No. 2014203909...
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IPC IPC(8): C25D5/02
CPCC25D5/026
Inventor 苏骞刘全胜柳兴森李鸿基孟敏
Owner 东莞奥美特科技有限公司