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Chip gluing device and method

A glue coating device and chip technology, which is applied to the surface coating liquid device, coating, electrical components, etc., can solve the problem that the processing quality of the glue layer cannot be guaranteed, so as to improve the grinding production efficiency and grinding quality, Accurately guarantee the processing quality and improve the integrity effect

Inactive Publication Date: 2017-05-31
CETC BEIJING ELECTRONICS EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention provides a chip gluing device and method to solve the problem that the traditional method cannot guarantee the processing quality of the glue layer

Method used

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  • Chip gluing device and method
  • Chip gluing device and method

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Embodiment Construction

[0028] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0029] see Figure 1 ~ Figure 3 , The chip gluing device of the embodiment of the present invention includes: a base plate 8, a heating device, a first motor 5, a flattening device, a carrying platform, a second motor 19, a first transmission member 9, a measuring instrument 21 and a vacuum cover 22.

[0030] In this embodiment, the heating device includes a heat-resistant plate 2, a heating platform 1, a heat-insulating plate 3 and a temperature control device, wherein the heating platform 1 is arranged on the heat-insulating plate 3, and the heat-insulating plate 3 is arranged on the heat-resistant plate 2 , both the heating table 1 and the heat insulation board 2 can be installed on the heat-resistant board 3 through screw connection, and the heat-res...

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Abstract

The invention provides a chip gluing device and method. The device comprises a bottom plate, a heating device, a first motor, a flattening device, a bearing table, a second motor, a first transmission part, a measuring instrument, a vacuum cover and a push frame. A bearing piece and glue liquid in a bearing disc are heated on the heating device to the specific temperature, the bearing disc is pushed by the push frame to the bearing table, the first motor drives the flattening device through the first transmission part to rotate, the thickness of a glue layer is controlled through the first transmission part and the measuring instrument, the second motor drives the bearing disc on the bearing table to rotate, the flattening device and the bearing table are matched to carry out rotary pressing, the rotary pressing process is in a vacuum negative pressure state, bubbles can be prevented from being produced, the uniformity of the glue layer is ensured, graph integrity is ensured after a chip is ground, and equipment reliability and stability are improved.

Description

technical field [0001] The invention belongs to the field of electronic product processing tools, and in particular relates to a chip gluing device and method. Background technique [0002] In the manufacturing process of semiconductor special equipment, the method of chip coating before thinning is the key technology to realize the quality of grinding wafer. In modern production equipment, chip gluing before thinning is generally achieved by manual gluing or gluing machine gluing. [0003] When grinding wafer chips, there is often a problem that part of the graphics has been exposed, and another part of the graphics has not been ground, or part of the graphics has been exposed, and the other part of the graphics has been worn. After analysis, it is found that the reason is that it is difficult for human hands in the process of manual gluing. Ensuring the uniformity of the glue layer leads to unevenness of the glue layer. On the other hand, manual glue application often was...

Claims

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Application Information

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IPC IPC(8): B05C9/14B05C15/00B05C11/02H01L21/683
CPCB05C9/14B05C11/02B05C15/00H01L21/6835H01L2221/68327
Inventor 贺东葛姚立新殷子文张敏杰杨生荣衣忠波王仲康
Owner CETC BEIJING ELECTRONICS EQUIP