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Fluorine-substituted vinyl polymer resin composition, prepreg and laminate

A technology of vinyl polymer and resin composition, which is applied in the direction of layered products, metal layered products, chemical instruments and methods, etc., which can solve the problems of difficult to make high-layer PCB boards, difficult control of substrate thickness uniformity, original coating The layer is easy to fall off and other problems, and the modulation is simple and easy, the reliability is low, and the effect of excellent dielectric properties is achieved.

Active Publication Date: 2020-10-09
VENTEC ELECTRONICS SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The method disclosed in this technology has complicated process and high cost, and the thickness uniformity of the prepared substrate is difficult to control, the appearance is not smooth, and it is difficult to make high-layer PCB boards.
U.S. Patent No. 2539329 mentioned the method of pretreating PTFE glass fiber cloth paint sheets at 205 °C, rolling and then impregnating to improve the "mud crack" phenomenon caused by excessive thickness of PTFE coating. It is easy to fall off when dipping, and it is difficult to laminate at temperatures below 250°C

Method used

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  • Fluorine-substituted vinyl polymer resin composition, prepreg and laminate
  • Fluorine-substituted vinyl polymer resin composition, prepreg and laminate
  • Fluorine-substituted vinyl polymer resin composition, prepreg and laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-4、 comparative example 1-2

[0051] In Examples 1-4 and Comparative Examples 1-2, the components are as shown in Table 1.

[0052] Table 1 Embodiment 1-4 and comparative example 1-2 component table

[0053]

[0054]

[0055] Table 2 shows the properties of the glue solutions prepared in Examples 1-4 and Comparison 1-2.

[0056] Table 2 Performance table

[0057]

[0058] As shown in Table 2, the fluorine-substituted vinyl polymer resin composition provided in Example 1 has a glass transition temperature of 175°C, a thermal decomposition temperature of 350°C, and a delamination time of more than 30 minutes at 288°C , the peel strength is 6.2lb / in, under the condition of 10GHz D k 、D f are 2.5 and 0.005, respectively.

[0059] Similarly, the fluorine-substituted vinyl polymer resin composition provided in Example 3 has a glass transition temperature of 176°C, a thermal decomposition temperature of 352°C, and a delamination time of more than 30 minutes at 288°C, and the peel strength It is 6lb / ...

Embodiment 5

[0064] A prepreg is prepared by impregnating the above-mentioned fluorine-substituted vinyl polymer resin composition into a base material and semi-curing or specially curing the impregnated base material.

[0065] The fluorine-substituted vinyl polymer resin composition has the above-mentioned structural formula (1), and its particle diameter can be less than 100 microns as mentioned above, or less than 90 microns, or less than 80 microns. , or less than 70 microns, or less than 60 microns, or less than 50 microns.

[0066] The substituent R of the fluorine-substituted vinyl polymer resin composition 1 ,R 2 ,R 3 ,R 4 At least one is a fluorine atom. In some other embodiments, the fluorine-substituted vinyl polymer resin composition is composed of one or two of polyvinyl fluoride, polytetrafluoroethylene, polyvinylidene fluoride, polytrifluoroethylene and A mixture of its various forms.

[0067] The number n of repeating units of the fluorine-substituted vinyl polymer res...

Embodiment 6

[0071] The prepreg obtained by impregnating the above-mentioned fluorine-substituted vinyl polymer resin composition into the base material to be semi-cured or specially cured is laminated with copper foil to obtain a laminate. The fluorine-substituted vinyl polymer resin composition used in the laminate has a structure such as formula (1), and its maximum particle size can be selected to be less than 100 microns, or less than 90 microns, or less than 80 microns, Or less than 70 microns, or less than 60 microns, or less than 50 microns.

[0072] The fluorine-substituted vinyl polymer resin composition substituent R 1 ,R 2 ,R 3 ,R 4 At least one is a fluorine atom. In some other embodiments, the fluorine-substituted vinyl polymer resin composition is composed of one or two of polyvinyl fluoride, polytetrafluoroethylene, polyvinylidene fluoride, polytrifluoroethylene and A mixture of its various forms.

[0073] The number n of repeating units of the fluorine-substituted vin...

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Abstract

The invention discloses a fluorine-substituted vinyl polymer resin composition and a prepreg and a laminate made therefrom. The fluorine-substituted vinyl polymer resin composition comprises a fluorine-substituted vinyl polymer resin and a functionalized polymer, wherein , the fluorine-substituted vinyl polymer resin is represented by the following formula, and its maximum particle size does not exceed 100 microns, the substituent R 1 , R 2 , R 3 , R 4 At least one of them is a fluorine atom, and the number n of repeating units is not less than 100. The preparation and modulation method of the composition in the present invention is simple, and the composition can be applied to electronic equipment, which greatly improves the signal transmission speed and reduces signal loss; the prepreg has uniform glue content, smooth surface, and stable performance; the laminated board has a simple manufacturing process and has excellent Mechanical, heat resistance and dielectric properties.

Description

technical field [0001] The invention relates to the field of electronic product materials, in particular to a fluorine-substituted vinyl polymer resin composition, a prepreg and a laminate. Background technique [0002] With the increasing development of wireless networks and satellite communications, information products are moving towards high speed and high frequency, and communication products are moving towards the standardization of voice, video and data through wireless transmission with large capacity and fast speed. Therefore, electronic products tend to be thinner and smaller, and are suitable for high-frequency transmission, and the wiring of circuit boards is becoming more dense and multi-layered. [0003] In order to maintain the transmission rate and maintain the integrity of the transmission signal, the substrate material of the circuit board must have a low dielectric constant (dielectric constant, Dk) and dielectric loss (also known as loss factor, dissipati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L71/12C08L27/14C08L79/04C08L27/18C08L27/16C08L9/00C08L27/12C08J5/04B32B15/082B32B15/20
CPCB32B15/082B32B15/20C08J5/043C08L27/12C08L27/16C08L71/123C08L79/04C08J2471/12C08J2427/18C08J2427/14C08J2409/00C08J2371/12C08J2379/04C08J2327/12C08J2327/16C08J5/244C08L27/14C08L27/18C08L9/00H05K1/024H05K1/0366C08J2427/12C08J2479/04C09J7/29H05K1/0373C08L2201/02C08L2203/20H05K2201/015H05K2201/012C08L87/00C09J2203/326C09J2400/163C09J2427/00C09J2471/00C09J2423/00
Inventor 钟健人王琢邹水平钱晋
Owner VENTEC ELECTRONICS SUZHOU
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