Heat dissipation structure of sticker chip led lamp
A technology of LED lamp and heat dissipation structure, which is applied in lighting and heating equipment, cooling/heating device of lighting device, components of lighting device, etc., can solve the problems of low heat dissipation efficiency, etc. The effect of increasing the area
Active Publication Date: 2019-05-10
重庆市志益鑫电子科技有限公司
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Problems solved by technology
[0004] The present invention intends to provide a heat dissipation structure for a chip LED lamp to solve the technical problem that the existing heat dissipation structure is aimed at cooling down the temperature of the chip LED lamp and the heat dissipation efficiency is low
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[0023] The present invention will be described in further detail below by means of specific embodiments:
[0024] The reference signs in the accompanying drawings of the specification include: waterproof membrane 1, water permeable hole 2, cover membrane 3, elastic water storage part 4, swing rod 5, first swing arm 51, second swing arm 52, fixed shaft 6, casing 7 , SMD LED8.
[0025] The heat dissipation structure of the sticker chip LED lamp in this embodiment is basically as follows: figure 1 As shown, it includes a waterproof film 1 overcoated on the SMD LED8LED, and a cover film 3 outside the waterproof film 1. There is a gap between the waterproof film 1 and the cover film 3, and the cover film 3 is in the LED A plurality of permeable holes 2 are evenly distributed on the part of the top surface, an elastic water storage part 4 is provided on the part of the cover film 3 on the end surface of the LED, and a bag is formed between the part of the waterproof membrane 1 on t...
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The invention discloses an SMD LED lamp heat dissipation structure. The SMD LED lamp heat dissipation structure comprises a waterproof film arranged on an SMD LED in a sleeving manner and a cover film arranged on the waterproof film in a sleeving manner, a gap exists between the waterproof film and the cover film, a permeable hole is formed in the position where the cover film is arranged on the top face of the LED, an elastic water storage portion is arranged on the position where the cover film is located on the end of the LED, and a bag-shaped space is formed between the position where the waterproof film is located at the end of the LED and the elastic water storage portion; a swing rod with the corner rotatably connected to a fixed rotating shaft is arranged outside the elastic water storage portion, and the side face of the swing rod abuts against the cover film; the swing rod comprises a first swing arm and a second swing arm, the side face of the first swing arm abuts against the elastic water storage portion, and the side face of the second swing arm abuts against the position, outside the elastic water storage portion, of the cover film. The technical problem that an existing heat dissipation structure cools an SMD LED lamp, and the heat dissipation efficiency is low is solved.
Description
technical field [0001] The invention relates to the technical field of LED lighting, in particular to a heat dissipation structure of a stick-type chip LED lamp. Background technique [0002] When a light-emitting diode (Light Emitting Diode, abbreviated as LED) is working, about 80% of the electric energy will be converted into heat energy, and 20% of the electric energy will be converted into light energy. When the LED chip is working, its own ambient temperature and The light output rate is inversely proportional to the relationship. The higher the temperature, the lower the light output rate. When the temperature reaches the maximum operating temperature of the LED chip, the LED will be broken. Temperature is directly related to LED life, light decay, and color temperature shift, so LED heat dissipation is very necessary. [0003] SMD LED lamps that use SMD LEDs as light-emitting elements usually array multiple SMD LEDs. The existing radiators use a structure such as he...
Claims
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IPC IPC(8): F21V29/51F21V31/00F21Y115/10
CPCF21V29/51F21V31/00
Inventor 黄生燕
Owner 重庆市志益鑫电子科技有限公司