Fixed wiring device for anti-plating insulated bundle

A wiring device and clustering technology, applied in the direction of connection insulation, multi-conductor connectors, etc., can solve the problems of cable entanglement space, short circuit or breakdown, occupation, etc., to reduce cable entanglement, reduce space occupation, and ensure insulation Effect

Pending Publication Date: 2017-06-20
RES INST OF PHYSICAL & CHEM ENG OF NUCLEAR IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

First of all, the common wiring device does not consider the function of anti-plating, so it is easy to cause short circuit or breakdown after metal vapor deposition; se

Method used

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  • Fixed wiring device for anti-plating insulated bundle
  • Fixed wiring device for anti-plating insulated bundle
  • Fixed wiring device for anti-plating insulated bundle

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The following is a detailed description of the anti-plating insulation bundled fixed wiring device of the present invention in conjunction with the drawings and embodiments of the specification:

[0026] Such as Figure 1~5 As shown, an anti-plating insulation cluster fixed wiring device includes a fixed assembly 2 and an anti-plating assembly 1 placed in the fixed assembly 2;

[0027] The anti-plating assembly 1 is composed of a ceramic base 3 and a ceramic sleeve 4; the ceramic base 3 is a cuboid structure with a through hole 31 formed in the middle, an annular boss 32 is formed on the upper end surface, and a small hole 33 is formed on the side wall; the ceramic sleeve The tube 4 is a cylindrical structure with a stepped hole 41 formed in the middle; the boss 32 is inserted into the large-diameter end of the stepped hole 41;

[0028] The fixing assembly 2 is a hollow cuboid structure composed of a mounting base 5 and a detachable mounting cover 6 ; two wiring holes ...

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PUM

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Abstract

The invention discloses a fixed wiring device for an anti-plating insulated bundle. The fixed wiring device comprises a fixed module and an anti-plating module arranged in the fixed module, wherein the anti-plating module consists of a ceramic substrate and a ceramic casing pipe; the ceramic substrate is a rectangular structure of which the middle is provided with a through hole; an annular boss is formed on an upper end surface, small holes are formed on one side wall; the ceramic casing pipe is a cylindrical structure of which the middle is provided with a step hole; the boss is put into one end, with a large aperture, of the stepped hole; the fixing module is a hollow rectangular structure consists of an installation substrate and a spreadable installation cover; two wiring holes are formed on the lower end surface of the installation substrate; and two casing pipe holes are formed on the installation cover. By use of the fixed wiring device, metal atom steam can be effectively prevented from being subjected to vapor deposition to the wiring device, the wiring device can be protected from short circuit breakdown, insulation is guaranteed, the bundle of the wiring device can be effectively fixed to reduce cable entanglement and space occupation.

Description

technical field [0001] The invention belongs to a bundled fixed wiring device, in particular to an anti-plating insulation bundled fixed wiring device. Background technique [0002] In the vacuum coating test and the application examples involving atomic evaporation, it often occurs that the wiring device needs to be protected against evaporation and insulated and fixed to avoid short circuit or breakdown of the wiring device due to metal vapor deposition, and to prevent evaporation. Protection and insulation fixation are of great importance for these tests and applications. Especially for some instances where the cables are densely arranged, there are strict insulation requirements and space size restrictions. First, the common wiring device does not consider the function of anti-plating, so it is easy to cause short circuit or breakdown after metal vapor deposition; second, the common device does not consider the function of clustering and fixing, so it is easy to cause c...

Claims

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Application Information

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IPC IPC(8): H01R11/03H01R4/70
CPCH01R4/70H01R11/03
Inventor 许涛赵星亮
Owner RES INST OF PHYSICAL & CHEM ENG OF NUCLEAR IND
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