Solder paste stirring equipment for electronic product manufacturing

A technology of stirring equipment and electronic products, applied in the direction of dissolution, mixer, chemical instruments and methods, etc., can solve the problems of complicated operation and low stirring efficiency, and achieve the effect of simple operation and high stirring efficiency

Inactive Publication Date: 2017-06-23
苍南博雅科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the shortcomings of low stirring efficiency and complicated operation of the current stirring equipment, the technical problem to be sol

Method used

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  • Solder paste stirring equipment for electronic product manufacturing
  • Solder paste stirring equipment for electronic product manufacturing
  • Solder paste stirring equipment for electronic product manufacturing

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0034] Example 1

[0035] A type of solder paste mixing equipment for electronic product manufacturing, such as Figure 1-6 As shown, it includes a bottom plate 1, a left frame 2, a top plate 3, a clamping mechanism 4, a lifting mechanism 5, and a stirring mechanism 6. A clamping mechanism 4 is installed in the middle of the top of the bottom plate 1, and a left frame 2 is installed on the left side of the top of the bottom plate 1. A top plate 3 is connected to the upper right side of the left frame 2, a lifting mechanism 5 is installed on the right side of the bottom of the top plate 3, and a stirring mechanism 6 is connected to the left side of the lifting mechanism 5.

Example Embodiment

[0036] Example 2

[0037] A type of solder paste mixing equipment for electronic product manufacturing, such as Figure 1-6 As shown, it includes a bottom plate 1, a left frame 2, a top plate 3, a clamping mechanism 4, a lifting mechanism 5, and a stirring mechanism 6. A clamping mechanism 4 is installed in the middle of the top of the bottom plate 1, and a left frame 2 is installed on the left side of the top of the bottom plate 1. A top plate 3 is connected to the upper right side of the left frame 2, a lifting mechanism 5 is installed on the right side of the bottom of the top plate 3, and a stirring mechanism 6 is connected to the left side of the lifting mechanism 5.

[0038] The clamping mechanism 4 includes a fixed seat 41, a first sliding rail 42, a first sliding block 43, an electric winding wheel 44, a first pull wire 45, a support rod 46, an arc pressing block 47, a support plate 48 and a first spring 410, a fixing seat 41 is installed on the top of the bottom plate 1, ...

Example Embodiment

[0039] Example 3

[0040] A type of solder paste mixing equipment for electronic product manufacturing, such as Figure 1-6 As shown, it includes a bottom plate 1, a left frame 2, a top plate 3, a clamping mechanism 4, a lifting mechanism 5, and a stirring mechanism 6. A clamping mechanism 4 is installed in the middle of the top of the bottom plate 1, and a left frame 2 is installed on the left side of the top of the bottom plate 1. A top plate 3 is connected to the upper right side of the left frame 2, a lifting mechanism 5 is installed on the right side of the bottom of the top plate 3, and a stirring mechanism 6 is connected to the left side of the lifting mechanism 5.

[0041] The clamping mechanism 4 includes a fixed seat 41, a first sliding rail 42, a first sliding block 43, an electric winding wheel 44, a first pull wire 45, a support rod 46, an arc pressing block 47, a support plate 48 and a first spring 410, a fixing seat 41 is installed on the top of the bottom plate 1, ...

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PUM

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Abstract

The invention relates to stirring equipment, in particular to solder paste stirring equipment for electronic product manufacturing. The invention solves the technical problems by providing the solder paste stirring equipment for electronic product manufacturing, which is simple in operation and high in stirring efficiency. In order to solve the technical problems, the invention provides such the solder paste stirring equipment for electronic product manufacturing. The solder paste stirring equipment for electronic product manufacturing comprises a bottom plate, a left frame, a top plate, a clamping mechanism, a lifting mechanism, a stirring mechanism and the like, wherein the clamping mechanism is mounted at the middle part of the top of the bottom plate; the left frame is mounted on the left side of the top of the bottom plate; the top plate is connected to the upper part of the right side of the left frame; the lifting mechanism is mounted on the right side of the bottom of the top plate; the stirring mechanism is connected to the left side of the lifting mechanism. Through synchronous rotation of the stirring mechanism and a solder paste barrel, the stirring efficiency is improved, manual stirring is not required, and the effects of simple operation and high stirring efficiency are achieved.

Description

technical field [0001] The invention relates to a stirring device, in particular to a solder paste stirring device for electronic product manufacturing. Background technique [0002] Electronic products are related products based on electric energy, mainly including: telephones, televisions, video disc players (VCD, SVCD, DVD), video recorders, camcorders, radios, tape recorders, combination speakers, CD players (CD), computers , mobile communication products, etc. [0003] Solder paste is also called solder paste, gray paste. Solder paste is a new type of soldering material that emerged with SMT. It is a paste mixture formed by mixing solder powder, flux, and other surfactants and thixotropic agents. It is mainly used for soldering electronic components such as PCB surface resistance, capacitor and IC in SMT industry. [0004] Solder paste needs to be stirred before use. The current mixing equipment has relatively low mixing efficiency and complicated operation. Therefor...

Claims

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Application Information

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IPC IPC(8): B01F9/12B01F29/83
CPCB01F29/34B01F29/40B01F29/83
Inventor 杨连数
Owner 苍南博雅科技有限公司
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