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Supersonic wave thickness meter having temperature detection function

An ultrasonic and thickness gauge technology, applied in the field of ultrasonic thickness gauges with temperature detection function, can solve problems such as the reduction of ultrasonic thickness measurement accuracy, and achieve the effect of overcoming wire connection

Inactive Publication Date: 2017-06-23
XIANGTAN HONGYUAN ELECTRONICS SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When propagating in a solid, temperature, stress, and the uniformity of material and composition are important factors affecting the speed of ultrasonic propagation. Therefore, when measuring the workpiece, when the stress, material and composition factors remain unchanged, once there is a temperature change , the ultrasonic propagation speed will change accordingly, and the accuracy of ultrasonic thickness measurement will be greatly reduced.

Method used

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  • Supersonic wave thickness meter having temperature detection function

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Embodiment Construction

[0021] The present invention will be described in further detail and completely below in conjunction with the embodiments and accompanying drawings.

[0022] An ultrasonic thickness gauge with temperature detection function, including a host, a probe group and a temperature sensing device arranged on the probe, the host includes a single-chip microcomputer and a display, the single-chip microcomputer is electrically connected to the display, and the single-chip microcomputer is used to receive temperature sensing The temperature data transmitted by the device and convert the temperature data into an instruction command for replacing the probe, the instruction command includes "please replace the normal temperature probe", "please replace the medium temperature probe", "please replace the high temperature probe"; the probe group includes the normal temperature probe , medium temperature probe and high temperature probe, wherein the temperature of the normal temperature probe tes...

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Abstract

The invention relates to a supersonic wave thickness meter having a temperature detection function. The supersonic wave thickness meter comprises a host computer, probes and connection wires connected with the host computer and the probes, wherein the probes are equipped with temperature sensing devices, and the temperature sensing devices are electrically connected with the host computer. Compared with the prior art, the supersonic wave thickness meter is advantaged in that workpiece temperature can be timely monitored, temperature influence on accuracy of supersonic wave thickness measurement can be avoided, the supersonic wave thickness meter is further provided with the multiple workpiece detection probes capable of adapting to different temperature scopes, so different probes can be selected by workers according to different workpiece temperatures. The supersonic wave thickness meter employs the wireless communication technology, and a wire connection defect can be solved.

Description

technical field [0001] The invention relates to an ultrasonic thickness gauge, in particular to an ultrasonic thickness gauge with a temperature detection function. Background technique [0002] Ultrasound is a sound wave with a frequency higher than 20,000 Hz. It has good directionality, strong penetrating ability, and is easy to obtain concentrated sound energy. Because of its convenient handling and good directivity, it is often used to measure various The wall thickness of plates and pipes, the wall thickness of boiler vessels and their local corrosion and rust conditions play a major role in the safe operation of equipment and modern management. Ultrasonic thickness measurement is based on the principle of ultrasonic pulse reflection. When the ultrasonic pulse emitted by the probe passes through the object to be measured and reaches the interface of the material, the pulse is reflected back to the probe. The thickness of the material. When propagating in a solid, temp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B17/02
CPCG01B17/02
Inventor 彭欣
Owner XIANGTAN HONGYUAN ELECTRONICS SCI & TECH CO LTD