A kind of manufacturing method of flexible circuit board
A flexible circuit board and manufacturing method technology, which is applied in the directions of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of insufficient support strength, low qualified rate of flexible circuit boards, and crushed products.
Active Publication Date: 2020-07-07
苏州市华扬电子有限公司
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[0002] At present, the product punching process in the production of flexible circuit boards in the electronics industry, such as the attached Figure 1-2 As shown, the product has a five-layer structure, including an intermediate substrate, a copper foil layer on both sides of the substrate, and a protective film on the outside of the copper foil layer, while the 0.2mm wide waste on the outer edge of the product has a three-layer structure. The copper foil layer is washed off in the copper etching process; when the product is punched, the waste material has a three-layer structure, the support strength is not enough, and the waste material is too thin, which may easily cause the waste material to warp and damage the product, so as to affect the electrical conductivity of the circuit board Performance, so that the yield of finished products made of flexible circuit boards is low
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[0013] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0014] attached Figure 3-4 The manufacturing method of the flexible circuit board according to the present invention includes a product 1; the product 1 is composed of a five-layer structure, the middle is a base material layer 4, and the upper and lower sides of the base material layer 4 are provided with copper foil layers 6, and the copper foil A protective film layer 5 is provided on the outside of the layer 6; the outer edge of the product 1 is provided with a waste material 2 with a width of 0.2 mm, and the waste material 2 and the product 1 are also composed of five layers of the same structure, which will not be repeated here; during punching, Die cutting in two steps. In the first step, the waste material 2 is punched off and a plurality of waste support blocks 3 arranged at intervals are left. In the second step, the waste ...
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The invention discloses a manufacturing method for a flexible circuit board, and the method comprises the steps: preparing a manufactured product, wherein the manufactured product consists of five layers, the central part is a base material layer, the upper and lower sides of the base material layer are respectively a copper foil layer, outer sides of the copper foil layers are provided with protection film layers, and the outer edge of the manufactured product is provided with a 0.2mm waste material which also consists of five layers; carrying out the punching at two steps: 1, cutting the waste material through punching, and keeping a plurality of waste support blocks at intervals; 2, cutting the waste support blocks through punching. The method provided by the invention guarantees the punching intensity, effectively avoids the warp caused by the excessively thin waste during punching, and prevents the turned edge from damaging the product.
Description
technical field [0001] The invention relates to a method for manufacturing a circuit board, in particular to a method for manufacturing a flexible circuit board that can prevent scrap materials from curling and scratching the flexible circuit board. Background technique [0002] At present, the product punching process in the production of flexible circuit boards in the electronics industry, such as the attached Figure 1-2 As shown, the product has a five-layer structure, including an intermediate substrate, a copper foil layer on both sides of the substrate, and a protective film on the outside of the copper foil layer, while the 0.2mm wide waste on the outer edge of the product has a three-layer structure. The copper foil layer is washed off in the copper etching process; when the product is punched, the waste material has a three-layer structure, the support strength is not enough, and the waste material is too thin, which may easily cause the waste material to warp and d...
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IPC IPC(8): H05K3/00
CPCH05K3/0044H05K2203/0228
Inventor 吴应官
Owner 苏州市华扬电子有限公司