Server and communication device
A server and radiator technology, applied in the field of communication, can solve the problems of easy vibration and low natural frequency of printed components, and achieve the effect of increasing the solid frequency
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Embodiment 1
[0034] figure 2 It is a schematic diagram of the external structure of the server provided by the embodiment of the present invention, image 3 A schematic diagram of the internal structure of the server provided by the embodiment of the present invention, such as figure 2 and image 3 As shown, the server provided by the embodiment of the present invention includes: a casing 1, a mainboard 2 and a mainboard cold plate 3, the four sides of the mainboard 2 are correspondingly overlapped with the four sides of the mainboard cold plate 3, the mainboard 2 and the mainboard cold plate 3 The cold plates 3 are all arranged in the casing 1 , and the two opposite sides of the cold plate 3 of the main board are connected with the casing 1 .
[0035] In the server provided in the embodiment of the present invention, the mainboard cold plate 3 is made of metal material, specifically, the mainboard cold plate 3 is made of aluminum alloy material, and the four sides of the mainboard 2 c...
Embodiment 2
[0056] The purpose of the second embodiment is to provide a communication device to alleviate the technical problem in the prior art that the main board and the printed components on the main board are prone to low-frequency resonance.
[0057] The communication device provided in Embodiment 2 includes an input device, a display device, and the server provided in Embodiment 1. The input device, the server, and the display device are sequentially connected with signals.
[0058] Such as figure 2 and image 3 As shown, in the communication equipment provided in the second embodiment, the four sides of the main board 2 in the server are correspondingly overlapped with the four sides of the main board cold plate 3, and both the main board 2 and the main board cold plate 3 are arranged on the casing 1 Inside, the two opposite sides of the main board cold plate 3 are connected with the casing 1 . The four sides of the main board 2 are correspondingly overlapped with the four side...
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