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Plate sucking device for batch positioning in chip welding

A suction plate device and chip welding technology, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of difficulty in mass production, low chip efficiency, etc., to ensure accurate positioning and facilitate batch positioning of chips. Effect

Pending Publication Date: 2017-07-14
RUGAO DACHANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is that the existing manual placement of chips is inefficient and difficult to meet the needs of mass production

Method used

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  • Plate sucking device for batch positioning in chip welding
  • Plate sucking device for batch positioning in chip welding
  • Plate sucking device for batch positioning in chip welding

Examples

Experimental program
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Effect test

Embodiment Construction

[0013] Such as Figure 1-3 As shown, the suction plate device used for batch positioning during chip welding provided by the present invention includes: a suction plate base 1 , a rectangular frame 2 and a base air valve.

[0014] Wherein, the rectangular frame 2 is installed on the upper part of the suction plate base 1; a support column 16 is provided at the bottom of the suction plate base 1, and a ball 17 is provided at the lower end of the support column 16; There is a chip slot 3; a chip air hole 4 is provided at the bottom of the chip slot 3; a base air cavity communicating with each chip air hole 4 is provided inside the suction plate base 1; Positioning column 5; the base air valve is installed on the side of the suction plate base 1, one end communicates with the base air cavity, and the other end is used to communicate with the vacuum pump of the suction system; on the side of the suction plate base 1 and close to the base air valve A handle 6 is provided.

[0015...

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Abstract

The invention provides a plate sucking device for batch positioning in chip welding, which comprises a plate sucking base, a rectangular frame and a base air valve, and is characterized in that the rectangular frame is installed at the upper part of the plate sucking base; the lower part of the plate sucking base is provided with supporting columns, and the lower end of each supporting column is provided with a ball; the upper part of the plate sucking base is provided with chip grooves which are located in the rectangular frame in an array mode; the bottom of each chip groove is provided with a chip air hole; the plate sucking base is internally provided with a base air cavity which is communicated with each chip air hole; the left edge and the right edge of the upper part of the plate sucking base are provided with positioning columns; the base air valve is installed at the side surface of the plate sucking base, one end of the base air valve is communicated with the base air cavity, and the other end is used for being communicated with a vacuum pump. The plate sucking device can realize positioning of chips in batches, and effectively improves the work efficiency. In addition, the whole positioning can be completed by one operator because of the action of the base air valve, so that the plate sucking device saves time and labor.

Description

technical field [0001] The invention relates to a positioning device during chip welding, in particular to a suction plate device used for batch positioning during chip welding. Background technique [0002] At present, in the process of manufacturing microchips, it is necessary to position each small chip in batches, so as to facilitate the batch welding of chips; but the existing positioning relies on manual placement one by one, which leads to low work efficiency and is difficult to meet the needs of mass production. . Contents of the invention [0003] The technical problem to be solved by the invention is that the existing manual placement of chips is inefficient and difficult to meet the needs of mass production. [0004] In order to solve the above technical problems, the present invention provides a suction plate device for batch positioning during chip welding, which includes a suction plate base, a rectangular frame and a base air valve; the rectangular frame is...

Claims

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Application Information

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IPC IPC(8): H01L21/68H01L21/60
CPCH01L24/74H01L24/95H01L21/68H01L2224/75744H01L2224/95121
Inventor 王志敏黄丽凤
Owner RUGAO DACHANG ELECTRONICS
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