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An electronic device, method and system for compensating stress-sensitive parameters

A stress-sensitive, electronic device technology, applied in the direction of electromagnetic measurement devices, printed circuit stress/deformation reduction, general control systems, etc., can solve the problems of stress-sensitive parameter deterioration, affecting the performance of electronic equipment, etc., to improve parameter quality, enhance The effect of using performance

Active Publication Date: 2021-11-12
ZTE CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention provides an electronic device, a method and a system for compensating stress-sensitive parameters to solve the deterioration of the stress-sensitive parameters of some electronic components caused by passive coping techniques for stress in the prior art, thus affecting the use of electronic equipment performance problem

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  • An electronic device, method and system for compensating stress-sensitive parameters
  • An electronic device, method and system for compensating stress-sensitive parameters
  • An electronic device, method and system for compensating stress-sensitive parameters

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Embodiment Construction

[0015] Below in conjunction with the accompanying drawings of the present invention in embodiments, the technical solutions in the embodiments of the present invention are clearly and completely described, the described embodiments are merely part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, other embodiments of ordinary skill in the art without creative efforts premise thus obtained fall within the protection scope of the present invention.

[0016] figure 1 Hardware environment is an architecture diagram of an electronic device according to the present preferred embodiment of the invention. The electronic device 1 comprises: compensating system stress sensitivity parameters 10, pressure sensor 11, the first panel 12, second panel 13, the stress sensitive element 14. The electronic device 1 may be, but is not limited to, mobile phones, tablet computers, cameras and the like. The second panel may be a printed...

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Abstract

The invention discloses a method for compensating stress-sensitive parameters. The method is applied to an electronic device. The method includes: calculating the deformation value of the first panel according to the pressure on the first panel; calculating the deformation value of the second panel deformed due to the deformation of the first panel; calculating the change of the stress sensitive parameter of the stress sensitive element located on the second panel according to the deformation value of the second panel; according to the A change in the stress-sensitive parameter compensates for the stress-sensitive parameter. The invention also discloses an electronic device and a compensation system for stress sensitive parameters. The invention can improve the parameter quality of corresponding electronic components and electronic modules, and ultimately improve the performance of electronic equipment.

Description

Technical field [0001] The present invention relates to an electronic apparatus, method and system parameter compensation, particularly relates to an electronic apparatus, a method and system for compensating stress sensitivity parameters. Background technique [0002] Some stress electronic module and electronic components on a printed circuit board (Printed Circuit Board, PCB) is generated by external factors (pressure, temperature, humidity, etc.) is more sensitive to deformation, so that the stress of the electronic module or electronic component Some important parameters of the group, so the design of the electronic device, the need to fully consider the effect of stress on the electronic component and the electronic component module. Prior art solutions, the main technical means of passive response, i.e., the stress-sensitive electronic components and electronic component modules as possible away from the region of the presence of a strong stress on the PCB panel, but still...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/398
CPCG06F30/398G01B7/20G01B7/16G05B15/02H05K1/0271H05K1/144H05K2201/042H05K2201/09136H05K2201/10083H05K2201/10151
Inventor 刘凤鹏刘冬梅
Owner ZTE CORP