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A package-on-package member and a method of fabricating a semiconductor device

A packaging and semiconductor technology on packaging, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as warping, large size, and inability to have gaps

Inactive Publication Date: 2017-07-18
MICRON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the above-mentioned stacked structure of the packaging components produced by the prior art cannot have an extremely tight gap, not only the volume is large, but also the problem of warping is prone to occur

Method used

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  • A package-on-package member and a method of fabricating a semiconductor device
  • A package-on-package member and a method of fabricating a semiconductor device
  • A package-on-package member and a method of fabricating a semiconductor device

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Embodiment Construction

[0049] The following detailed description shall refer to the contents shown in the related drawings, which are used to illustrate embodiments that can be implemented according to the present invention. These embodiments provide sufficient details to enable those skilled in the art to fully understand and practice the present invention. Structural, logical and electrical modifications may be applied to other embodiments without departing from the scope of the present invention.

[0050] Therefore, the ensuing detailed description is not intended to limit the invention. The scope of the invention is defined by its claims. It has the same meaning as the claims of the present invention, and should also belong to the scope covered by the present invention.

[0051] In the following description, reference should be made to the relevant drawings for a thorough understanding of the present invention, wherein the same or similar features are generally depicted with the same reference...

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Abstract

The present invention discloses a package-on-package member comprising a bottom package and a top package disposed on the bottom package. The bottom package comprises a redistribution layer structure, at least one crystal grain, disposed on the redistribution layer structure and coated with a molding compound, a plurality of silicon through holes (TSVs) located in the grains, (TMVs) provided around the grains, and a plurality of solder bumps or solder balls. The aperture of each of said through-holes is larger than the aperture of each of said through-holes. The top package is electrically connected to the bottom package through the through-silicon via (TSVs) and the through-die via (TMVs). The present invention also discloses a method of fabricating a semiconductor device.

Description

technical field [0001] The invention relates to the field of semiconductor packaging and a method for manufacturing a semiconductor device, in particular to an on-package packaging component with packaging holes of different sizes, which can be used to package chips with different functions into a package. Background technique [0002] With the advancement of semiconductor manufacturing technology, the size of microelectronic components is getting smaller and smaller, and the circuits in them are getting denser and denser. In order to further reduce the size, the packaging structure of the microelectronic components mounted on the circuit board must also be more compact. [0003] 3D packaging technology, such as package on package (package on package) technology, can produce packaging components with higher integration and tighter packaging pins. Generally speaking, the package-on-package structure usually includes a semiconductor die package on the top, stack bonded to ano...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/56H01L21/60H01L23/488H01L23/31H01L25/00
CPCH01L21/50H01L21/561H01L21/568H01L23/3114H01L23/3128H01L23/3135H01L24/17H01L24/81H01L24/97H01L25/50H01L2224/81005H01L2224/04105H01L2224/12105H01L2224/13025H01L2224/16227H01L2224/17181H01L2224/19H01L2224/48091H01L2224/48227H01L2224/73259H01L2224/9222H01L2224/96H01L2224/97H01L2225/1023H01L2225/1035H01L2225/1058H01L2924/15192H01L2924/15311H01L2924/181H01L2924/18162H01L2924/3511H01L2924/00014H01L2924/00012H01L2224/81
Inventor 施信益吴铁将
Owner MICRON TECH INC