Heat dissipation chassis and its printed board assembly
A technology for printed boards and components, applied in electrical components, electrical equipment structural parts, cooling/ventilation/heating renovation, etc., can solve the problems of complex heat pipe fixing structure and high cost, and achieve fast, efficient heat conduction and low cost.
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[0026] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings.
[0027] The specific embodiment of the cooling cabinet of the present invention, as Figure 1 to Figure 6 As shown, in order to conduct the heat in the cooling case to the outside of the cooling case in time, the present invention formulates three cooling methods. The first type is to install the cover plate radiator 2 on the cover plate, the second type is for the heat dissipation of the first plug-in 3 with relatively large heat generation, and the third type is for the heat dissipation of the second plug-in 4 with small heat generation.
[0028] The first type is to provide a through hole on the cover plate 1 of the cooling case, and set a cover plate radiator 2 in the through hole. The cover plate radiator 2 includes a body 21, the inner side of the body 21 is located in the cooling case, and the outer side is located outside the cooling case , the i...
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