Heat dissipation chassis and its printed board assembly

A technology for printed boards and components, applied in electrical components, electrical equipment structural parts, cooling/ventilation/heating renovation, etc., can solve the problems of complex heat pipe fixing structure and high cost, and achieve fast, efficient heat conduction and low cost.

Active Publication Date: 2019-11-01
XUJI GRP +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the above-mentioned plug-in, when the number of electronic components is multiple and the calorific value of each electronic component is different, if all heat pipes are used for heat conduction, the cost is relatively high, and the fixing structure of the heat pipe is relatively complicated.

Method used

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  • Heat dissipation chassis and its printed board assembly
  • Heat dissipation chassis and its printed board assembly
  • Heat dissipation chassis and its printed board assembly

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Embodiment Construction

[0026] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0027] The specific embodiment of the cooling cabinet of the present invention, as Figure 1 to Figure 6 As shown, in order to conduct the heat in the cooling case to the outside of the cooling case in time, the present invention formulates three cooling methods. The first type is to install the cover plate radiator 2 on the cover plate, the second type is for the heat dissipation of the first plug-in 3 with relatively large heat generation, and the third type is for the heat dissipation of the second plug-in 4 with small heat generation.

[0028] The first type is to provide a through hole on the cover plate 1 of the cooling case, and set a cover plate radiator 2 in the through hole. The cover plate radiator 2 includes a body 21, the inner side of the body 21 is located in the cooling case, and the outer side is located outside the cooling case , the i...

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PUM

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Abstract

The invention provides a heat radiating cabinet and a printed board assembly thereof, thereby realizing a purpose of reducing heat radiation cost on the condition that a plurality of electronic components exist on the printed board. The printed board assembly comprises a printed board and a heat radiator. The printed board is provided with a first electronic component and a second electronic component. The heating amount of the first electronic component is higher than that of the second electronic component. The first electronic component is connected with the heat radiator through a heat pipe in a heat conduction manner. The second electronic component is connected with the heat radiator through a heat conduction plate in the heat conduction manner. According to different heating amounts of the electronic components, different heat conducting mediums are selected. The heat pipe is utilized for the component with high heating amount for realizing heat conduction, thereby realizing quick and efficient heat conduction by means of a high heat conduction effect of the heat pipe; and the heat conduction plate is utilized for the component with low heating amount for performing heat conduction as the cost of the heat conduction plate is lower than that of the heat pipe.

Description

technical field [0001] The invention relates to a cooling case and a printed board assembly thereof. Background technique [0002] With the development of intelligent equipment and the application of prefabricated cabins, the future development of the chassis of power equipment will tend to be more and more miniaturized and integrated. Miniaturization and integration also cause heat concentration of components in the chassis. Therefore, The chassis needs to have a strong heat dissipation capability. Once a fault occurs, it will cause the components to overheat and stop working or even burn out, causing equipment failure or even a power outage. However, the heat dissipation method of power equipment is usually arranged on the chassis by arranging heat dissipation holes. For high-heat and high-power devices, fan cooling is supplemented. Fans need to be maintained and replaced regularly, which consumes manpower, especially in remote mountainous substations. Maintenance is even...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20336H05K7/20409
Inventor 许超伟王振华贺渊明郭震陈号孙世杰宋一丁孙莹莹
Owner XUJI GRP
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