PCB inner circuit interconnection structure and processing method thereof

A technology of inner-layer circuit and interconnection structure, which is applied in the direction of multi-layer circuit manufacturing, printed circuit, printed circuit manufacturing, etc., to achieve the effect of eliminating parasitic effect distortion and ensuring normal conduction.

Active Publication Date: 2017-07-21
SHENNAN CIRCUITS
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a PCB inner layer circuit interconnection structure and a processing method thereof, which are used to solve signal transmission-related problems caused by traditional via stubs and ensure interlayer conduction

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PCB inner circuit interconnection structure and processing method thereof
  • PCB inner circuit interconnection structure and processing method thereof
  • PCB inner circuit interconnection structure and processing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0015] The terms "first", "second", "third" and the like in the description and claims of the present invention and the above drawings are used to distinguish different objects, rather than to describe a specific order. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclus...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a PCB inner circuit interconnection structure and a processing method thereof, and is used for solving problems related to signal transmission and caused by a conventional via hole stub and ensuring layer-to-layer conduction. The technical scheme is that the PCB inner circuit interconnection structure comprises a conductive material arranged between an Lm layer and an Lm+1 layer of the PCB inner circuit and used for achieving layer-to-layer conduction, and a via hole passing through the position of the conductive material, hole copper of the via hole is connected with the conductive material, hole copper of the via hole in certain depth is removed, the depth of the removed hole copper is between the Lm layer and the Lm+1 layer, and m is a positive integer.

Description

technical field [0001] The invention relates to the technical field of PCB processing, in particular to a PCB inner layer circuit interconnection structure and a processing method thereof. Background technique [0002] Printed circuit boards (Printed Circuit Board, PCB) are more and more widely used, and the design requirements are becoming more and more complex. When designing the inner layer circuit, the customer has high signal transmission requirements for the inner layer circuit of some holes or slots. According to the principle of parasitic effect, when a signal transmits an active link in the line, other parameters besides its own parameters will be generated, such as parasitic inductance, parasitic capacitance, coupling capacitance, etc. However, when designing circuits, many inner-layer circuits that do not need to be connected can be connected due to the limitation of processing technology. [0003] The traditional processing method of the via hole in the PCB is ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K3/46
CPCH05K1/116H05K3/4611H05K2203/0207
Inventor 陈绪东邓杰雄谢占昊缪桦
Owner SHENNAN CIRCUITS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap