A method for punching holes in a circuit board

Abstract

The invention relates to the field of machining, and especially relates to a punching method for a circuit board. The method employs a rack, a drilling mechanism, a cluster mechanism and a conveying belt located between the drilling mechanism and the cluster mechanism. The cluster mechanism is located below a drill bit, and comprises a machining ring which is rotatingly connected to the rack, and a machining platform which is fixedly connected to the rack. The machining platform is coaxially installed in the machining ring, and through holes are uniformly distributed in the peripheral direction of the machining ring. Moreover, the machining ring is provided with an annular through groove, and one side of the annular through groove is provided with an annular toothed surface. The interior of the machining platform is radially provided with a pipe, and the pipe is located at the lower side of a movable shaft. An inlet of the pipe extends outwards to be provided with a guide plate. The upper and lower sides of the interior of the pipe are respectively connected with arc-shaped discs. The two arc-shaped discs are arranged to be opposite to each other, and the rotation directions of the two arc-shaped discs are opposite. According to the above technical scheme of the invention, the method achieves the processing of fragments generated in the punching process of a bakelite plate.

Description

technical field [0001] The invention relates to the field of processing, in particular to a processing device for bakelite boards. Background technique [0002] The bakelite board is made of high-quality bleached wood paper and cotton linter paper as reinforcement, and the phenolic resin produced by the reaction of high-purity, fully synthetic petrochemical raw materials is used as the resin binder, which is non-toxic and non-toxic. Harmful. Because of its characteristics of insulation, no static electricity, wear resistance and high temperature resistance, it is used in insulating switches and variable resistors of electronic products, molds for machinery and fixtures on production lines, and is most commonly used for circuit experiments. Perfboard (a type of circuit board). [0003] In the prior art, the method of batch punching is usually used to process bakelite boards into perforated boards. Although this method has high punching efficiency, the debris generated durin...

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Problems solved by technology

[0003] In the prior art, the method of batch punching is usually used to process bakelite boards into perforated boards. Although this method has high punching efficiency, the debris generated during the punching process is collected artificially. After collection, it is usually It is directly wasted, but the material of bakelite board is non-toxic and harmless and can be used to make various handicrafts or other finished products, so the applicant proposed a solution to deal with scraps of bakelite board

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