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Electronic Component Packaging Unit

A technology for electronic components and packaging, applied in the field of electronic component packaging units, can solve the problems of shortened service life, easy aging (such as weathering, corrosion and oxidation, and failure to effectively prevent electronic components from aging, etc.), and achieve the effect of long service life.

Active Publication Date: 2021-07-02
李天俊
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Electronic components have the characteristics of high precision, intelligent integration, and wide application range. At the same time, electronic components usually have metal parts. Due to the characteristics of metals, electronic components have the problem of easy aging (such as weathering, corrosion and oxidation), which greatly shortens the time. The service life of electronic components and equipment including the electronic components will further lead to the production of the electronic components and the use of living equipment, which will cause serious safety hazards; on the other hand, according to the use of electronic components, technology The difference in content and cost leads to the high value of some electronic components, and the protection of such electronic components is more important
[0003] However, there is no effective method to prevent electronic components from aging (such as weathering, corrosion and oxidation) in the prior art

Method used

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  • Electronic Component Packaging Unit
  • Electronic Component Packaging Unit
  • Electronic Component Packaging Unit

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Experimental program
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Embodiment

[0047] Next, in order to describe the structure and working principle of the electronic component packaging unit 110 more intuitively and specifically, we will introduce the concept of the packaging assembly 100 next. Specifically, the packaging assembly 100 includes an electronic component packaging unit 110 and an electronic component 120 sealed in an accommodating space of the electronic component packaging unit 110 , and the accommodating space is filled with a predetermined volume of protective gas 130 . It should be noted that one way of filling the preset volume of protective gas 130 here is to completely evacuate the storage space first, and then fill the storage space with a preset volume of protective gas 130, so that the protective gas 130 fills the entire storage space. in space.

[0048] Please refer to figure 1 , figure 1 A schematic structural diagram of an electronic component packaging unit 110 is provided for this embodiment. It can be seen from the figure...

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Abstract

The invention relates to the field of electronic equipment and packaging, in particular to an electronic component packaging unit, aiming to solve the problem of electronic component aging (such as weathering, corrosion and oxidation) in the prior art. The electronic component packaging unit has a closed accommodating space; the electronic components are sealed in the accommodating space of the electronic component packaging unit, and the accommodating space is filled with a preset volume of protective gas. Such an electronic component packaging unit has a simple structure, is stable and reliable, and greatly improves the problem of easy aging of electronic components in the prior art.

Description

technical field [0001] The invention relates to the field of electronic equipment and packaging, in particular to an electronic component packaging unit. Background technique [0002] As an important part of the third industrial revolution, electronic components play an important role in modern production and all aspects of life. With the adjustment of industrial reform, more and more products use electronic components. Electronic components have the characteristics of high precision, intelligent integration, and wide application range. At the same time, electronic components usually have metal parts. Due to the characteristics of metals, electronic components have the problem of easy aging (such as weathering, corrosion and oxidation), which greatly shortens the time. The service life of electronic components and equipment including the electronic components will further lead to the production of the electronic components and the use of living equipment, which will cause s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65D81/05B65D81/18B65D85/86
CPCB65D2585/86B65D25/00B65D81/2069B65D81/266
Inventor 李天俊
Owner 李天俊