Chip part mounter and method for minimizing error in chip part mounter

Abstract

The invention discloses a chip part mounter and a method for minimizing errors in the chip part mounter. According to one embodiment, the chip part mounter includes a supporting hanger frame, which can reciprocatingly move along a first and a second guide rails that are parallelly arranged; a mounting head, which moves on the supporting hanger frame vertically relative to the moving direction of the supporting hanger frame, thus adsorbing or installing parts; a camera, which recognizes the parts by photographing the parts; a first driving motor, which moves the supporting hanger frame on the first guide rail; a second motor, which moves the supporting hanger frame on the second guide rail; a first driver, which drives the first motor through application of current; a second driver which drives the second motor through application of current; a first driver controller and a second driver controller repsectively controlling the first driver and the second driver; and a determination part, which determines whether the position error value of the supporting hanger frame is equal to or smaller than a preset error value when one of the first and the second driving motors is stopped.

Description

technical field [0001] The present invention relates to a chip component mounting machine and a method for minimizing the error of the chip component mounting machine, and more particularly to a chip component mounting machine and a chip component mounting machine capable of minimizing mounting degree errors caused by skew deformation. error minimization method. Background technique [0002] Flip chip mounter (flip chip mounter) is a semiconductor process equipment, and the degree of mounting becomes the main issue of equipment performance. Recently, the degree of mounting of 8 μm to 5 μm level is required. [0003] For this reason, it is important to minimize the deformation of the gantry mechanism, and the verticality (perpendicularity) has been maintained when assembling the gantry mechanism in the past. However, at the moment when power is applied to the drive motor, an imbalance of force between the motors on both sides occurs, so that a phenomenon occurs in which the ...

AI Technical Summary

Problems solved by technology

However, at the moment when the power is applied to the drive motor, an imbalance of the forces of the motors on both sides occurs, so that the mechanism is twisted at a predetermined angle, which is called skew.

[0004] For the flip chip mounter, since the camera for identification is installed in the head attached to the hanger, if the distortion occurs, the position of the camera will also change, so there is a problem that it will directly affect the installation degree.

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