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Chip component mounter and error minimization method of chip component mounter

A technology for placement machines and components, applied in electrical components, electrical components and other directions, can solve the problems of the influence of installation degree, the imbalance of motors on both sides, and the distortion of the mechanism, so as to minimize the installation error.

Active Publication Date: 2020-12-08
HANWHA AEROSPACE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at the moment when the power is applied to the drive motor, an imbalance of the forces of the motors on both sides occurs, so that the mechanism is twisted at a predetermined angle, which is called skew.
[0004] For the flip chip mounter, since the camera for identification is installed in the head attached to the hanger, if the distortion occurs, the position of the camera will also change, so there is a problem that it will directly affect the installation degree.

Method used

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  • Chip component mounter and error minimization method of chip component mounter
  • Chip component mounter and error minimization method of chip component mounter
  • Chip component mounter and error minimization method of chip component mounter

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Embodiment Construction

[0028] The advantages, features and methods for achieving the object of the present invention will be clearly understood with reference to the following embodiments described in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, which can be implemented in various forms different from each other, and this embodiment is provided only to complete the disclosure of the present invention and to complete the scope of the present invention. Those with basic knowledge in the technical field to which the present invention pertains should be informed that the present invention is only defined by the scope described in the claims.

[0029] The terms used in this specification are for describing examples only, and are not intended to limit the present invention. In this specification, a singular type includes a plural type unless otherwise specifically indicated in a sentence. The term "comprises" and / o...

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Abstract

The invention discloses a chip component mounting machine and a method for minimizing errors of the chip component mounting machine. A chip component mounting machine according to an embodiment of the present invention includes: a support hanger, which can reciprocate along the first and second guide rails arranged in parallel; Move in the vertical direction, and absorb or install the parts; the camera identifies the parts by photographing the parts; the first drive motor moves the hanger along the first guide rail; the second drive motor makes the hanger move along the The second guide rail moves; the first driver drives the first driving motor by applying current; the second driver drives the second driving motor by applying current; the first and second driver control parts respectively control the first . The second driver; the judging part, when one of the first and second driving motors stops driving, judging whether the position error value of the hanger is equal to or smaller than the set error value.

Description

technical field [0001] The present invention relates to a chip component mounting machine and a method for minimizing the error of the chip component mounting machine, and more particularly to a chip component mounting machine and a chip component mounting machine capable of minimizing mounting degree errors caused by skew deformation. error minimization method. Background technique [0002] Flip chip mounter (flip chip mounter) is a semiconductor process equipment, and the degree of mounting becomes the main issue of equipment performance. Recently, the degree of mounting of 8 μm to 5 μm level is required. [0003] For this reason, it is important to minimize the deformation of the gantry mechanism, and the verticality (perpendicularity) has been maintained when assembling the gantry mechanism in the past. However, at the moment when power is applied to the drive motor, an imbalance of force between the motors on both sides occurs, so that a phenomenon occurs in which the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/08
CPCH05K13/08
Inventor 金奉俊
Owner HANWHA AEROSPACE CO LTD