Multilayer chip ceramic capacitor
A chip type, capacitor technology, applied in capacitors, fixed capacitors, parts of fixed capacitors, etc., can solve the problems of many manufacturing processes, complex structures, and high production costs, and achieve fewer manufacturing processes, simple structures, and production costs. low effect
Inactive Publication Date: 2017-08-04
南通星晨电子有限公司
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Problems solved by technology
[0003] The technical problem to be solved by the present invention is to provide a chip capacitor to overcome that the existing chip capacitor includes a capacitor body and a base, and two leads are drawn from the positive and negative poles of the capacitor body, and these two leads are fixedly arranged On the base under the capacitor body, the base is used to support the capacitor body. Due to the use of the base, the structure is complicated, the manufacturing process is many, and the technical problems of high production cost
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[0010] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0011] refer to figure 1 with figure 2 , a chip capacitor, including a capacitor body 1, the positive and negative poles of the capacitor body 1 lead out a first lead 2 and a second lead 3, and the first lead 2 is divided into a vertical part 21 and a bent part 22 The vertical portion 21 of the first lead 2 is the front portion of the first lead 2 linearly extending along the length direction of the capacitor body, and the bent portion 22 of the first lead 2...
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The invention discloses a multilayer chip ceramic capacitor comprising a capacitor body. A first lead and a second lead are led out from the positive and negative poles of the capacitor body respectively. The first lead consists of a vertical part and a bent part, wherein the vertical part is the front section part of the first lead linearly extending along the length direction of the capacitor body, the bent part is formed by bending the rear section part of the first lead, and different bent sections are in the same plane. The second lead consists of a vertical part and a bent part, wherein the vertical part is the front section part of the second lead linearly extending along the length direction of the capacitor body, the bent part is formed by bending the rear section part of the second lead, and different bent sections are in the same plane. The vertical part of the first lead and the vertical part of the second lead are parallel to each other, and are of equal length. The bent part of the first lead and the bent part of the second lead are not in contact, and the plane where the bent parts are located is parallel to the cross section of the capacitor body. The multilayer chip ceramic capacitor has the advantages of simple structure, fewer manufacturing steps, and low cost.
Description
technical field [0001] The invention relates to capacitor manufacturing technology, in particular to a chip capacitor. Background technique [0002] At present, the chip capacitors on the market include a capacitor body and a base. Two leads are drawn from the positive and negative poles of the capacitor body, and these two leads are fixed on the base below the capacitor body. The base is used to support the capacitor. Due to the use of the base, the main body has a complex structure, many manufacturing processes and high production cost. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a chip capacitor to overcome that the existing chip capacitor includes a capacitor body and a base, and two leads are drawn from the positive and negative poles of the capacitor body, and these two leads are fixedly arranged On the base below the capacitor body, the base is used to support the capacitor body. Due to the use of the...
Claims
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Login to View More IPC IPC(8): H01G4/228H01G4/248
CPCH01G4/228H01G4/248
Inventor 李志刚葛红飞
Owner 南通星晨电子有限公司