Camera module test socket

Abstract

The invention discloses a camera module testing socket which comprises the components of a base board that is provided with an interface block that is connected with a main circuit board and is configured in a manner of supporting a camera module at the top; and a cover board whihc is configured for opening or closing top of the base board and comprises a connecting pin block and a sub circuit board that are mounted on the cover board, wherein the connecting pin block is connected with the connector of the camera module. The cover board is provided with an insertion block which is configured for electrically connecting a Pogo pin of the interface block with the contact of the sub circuit board when the cover board closes top of the base board. According to the camera module test socket, the camera test socket is configured for preventing sub circuit board replacement caused by contact wearing when the pins and contacts of the interface block repeatedly contact in a testing process.

Description

technical field [0001] The present invention relates to a camera module test socket, and more particularly to a camera configured to prevent the need to replace a sub-circuit board due to worn electrical contacts even if pins and electrical contacts of an interface block repeatedly contact each other during testing Modular test socket. Background technique [0002] After the various components are assembled, the camera module of the cellular phone is tested to check whether there is an abnormality in the module, such as an open-short (OS) test, a color rendering test, and a pixel test. In evaluating the performance of the camera module, signals are received from the image sensor to evaluate the characteristics of the image sensor, and inspection is performed by supplying the same operating signal and power as those actually equipped with the camera module to determine whether there is an abnormality in the camera module. [0003] Such as figure 1 As shown, in the inspectio...

AI Technical Summary

Problems solved by technology

[0006] However, there is a problem with the above-mentioned conventional test socket 1000: in the process of repeatedly opening / closing the test socket 1000 to test the camera module 1, the pins of the interface block 1120 are in physical contact with the electrical contacts formed on the sub-circuit board SB, quickly wear and tear

Therefore, within five (5) days the plating will be detached from the electrical contacts of the sub-circuit board SB and the sub-circuit board SB must be replaced

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