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Exposure method for exposure process of single-sided circuit board substrate

An exposure method and board substrate technology are applied in chemical/electrolytic methods to remove conductive materials, printed circuits, printed circuit manufacturing, etc., which can solve problems such as increased labor costs and cumbersome operation processes, and reduce film costs and operations. Convenience and the effect of improving equipment production efficiency

Inactive Publication Date: 2017-08-15
南京市罗奇泰克电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The exposure process is mainly based on the engineering data to make the corresponding film, and then the film is aligned with the board through the positioning nails, and finally it is completed by ultraviolet light irradiation in the exposure machine. In the early stage, the light exposure has been used, two people operate, one For one exposure, the operation process is cumbersome. A single material number has to produce two sets of production materials according to the size of the exposure table. Two people operate at the same time, resulting in an increase in labor costs, but the output has not increased.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] An exposure method for a single-sided circuit board substrate exposure process, comprising the following steps:

[0016] 1) The exposure process has been using the uplight exposure method instead of the downlight exposure method;

[0017] 2) Stick the film on the glass table with 3M adhesive tape;

[0018] 3) Paste the circuit board substrate on the film in reverse for exposure.

[0019] The circuit board substrate in step 3) is a single-side exposure product; one operator can complete this process.

[0020] The exposure method of the single-sided circuit board substrate exposure process of the present invention is easy to operate, and can be completed independently by one operator; the production efficiency of the equipment can be improved, and not only the cost of the film but also the labor cost can be reduced.

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PUM

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Abstract

The invention discloses an exposure method for the exposure process of a single-sided circuit board substrate, which comprises the following steps: 1) Changing the exposure process from the upper light exposure method to the lower light exposure; 2) Sticking the film on the 3) Paste the circuit board substrate on the film in reverse for exposure. The rapid etching method of the single-sided circuit board of the present invention is simple to operate, can improve work efficiency, double production efficiency, and can save various costs. The exposure method of the single-sided circuit board substrate exposure process of the present invention is easy to operate, and can be completed independently by one operator; the production efficiency of equipment can be improved, and not only the cost of the film but also the labor cost can be reduced.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to an exposure method in the exposure process of a single-sided circuit board substrate. Background technique [0002] The exposure process is mainly based on the engineering data to make the corresponding film, and then the film is aligned with the board through the positioning nails, and finally it is completed by ultraviolet light irradiation in the exposure machine. In the early stage, the light exposure has been used, two people operate, one The operation process is cumbersome for one exposure. A single material number requires two sets of production materials according to the size of the exposure table. Two people operate at the same time, resulting in an increase in labor costs, but the output does not increase. Contents of the invention [0003] Purpose of the invention: In order to overcome the deficiencies of the prior art, the present invention aims to ...

Claims

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Application Information

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IPC IPC(8): H05K3/06H05K3/00
CPCH05K3/06H05K3/0023H05K2203/052
Inventor 楼方禄
Owner 南京市罗奇泰克电子有限公司
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