Ultrasonic wave cleaning device for silicon wafer

Abstract

The invention relates to the technical field of silicon wafer production equipment, and particularly relates to an ultrasonic wave cleaning device for a silicon wafer. The ultrasonic wave cleaning device for a silicon wafer comprises a machine frame with a cleaning tank, wherein a bottom plate is rotatably arranged on the machine frame; the bottom plate is located inside the cleaning tank; an ultrasonic wave transducer is disposed on the bottom plate; a first driving device for driving the bottom plate to swing is disposed on the machine frame; and a framework for holding inserted wafer cases is disposed inside the cleaning tank. When the ultrasonic wave cleaning device for a silicon wafer, provided by the invention, is used, the bottom plate is driven to swing by the first driving device, so that silicon wafers can be cleaned by the ultrasonic transducer from multiple angles; and the silicon wafers on the framework are slightly rotated by a swing mechanism, so that the silicon wafers can be better cleaned. According to the ultrasonic wave cleaning device for a silicon wafer, provided by the invention, the silicon wafers can be cleaned from multiple angles, the cleaning efficiency is high; and the problem that relatively-difficult-to-wash impurities on the silicon wafers cannot be washed due to the fact that the silicon wafers are static in the cleaning tank and the quality of the subsequently-produced silicon wafers is reduced as a result is solved.

Description

technical field [0001] The invention relates to the technical field of silicon wafer production equipment, in particular to an ultrasonic cleaning device for silicon wafers. Background technique [0002] In the production of transistors and integrated circuits, almost every process has the problem of silicon wafer cleaning. The quality of silicon wafer cleaning has a serious impact on device performance. Improper handling may cause all silicon wafers to be scrapped and tubes cannot be produced. Or the manufactured device has poor performance, poor stability and reliability. Therefore, it is of great significance to develop a high-cleanliness and efficient method for cleaning silicon wafers, both for those engaged in silicon wafer processing and for those engaged in the production of semiconductor devices. The existing silicon wafer cleaning equipment directly places the silicon wafer in the cleaning tank, and uses ultrasonic waves to clean the silicon wafer. The quality of...

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is: in order to solve the problem that the silicon wafer is still in the cleaning tank, making it difficult

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