Heat dissipation structure and drone with the heat dissipation structure
A technology of heat dissipation structure and drone, which is applied to the structural parts of electrical equipment, cooling/ventilation/heating transformation, electrical components, etc., can solve the problems of affecting the appearance effect, the large volume of camera gimbal components, and difficulty in designing heat dissipation structures.
Inactive Publication Date: 2019-06-11
SZ DJI TECH CO LTD
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Problems solved by technology
However, in the current drone models, the solid-state drive is located on the gimbal assembly of the drone camera. Due to the slender shape of the solid-state drive and the required heat dissipation structure of the solid-state drive when it is working, Make the entire camera gimbal component too large, affect the overall appearance, and it is difficult to design the heat dissipation structure
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[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0022] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, t...
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A heat dispersion structure, and an unmanned aerial vehicle provided with the heat dispersion structure. The heat dispersion structure is used for dissipating heat from a substrate assembly (10) and a storage device (20). The heat dispersion structure comprises: a housing (1), used for accommodating the substrate assembly (10) and the storage device (20); and a heat dispersion fan (30), mounted on the housing (1) and supplying a heat dissipation air flow into the housing (1). A first accommodating space for accommodating the substrate assembly (10), a second accommodating space for accommodating the storage device (20) and a heat dissipation air duct for guiding heat dissipation air flows to flow through the first accommodating space and the second accommodating space are disposed in the housing (1). The heat dispersion fan drives air flows outside the housing to enter the heat dissipation air duct, so as to supply the heat dissipation air flows into the housing and guide, through the heat dissipation air duct, the heat dissipation air flows to flow through the substrate assembly accommodated in the first accommodating space and the storage device accommodated the second accommodating space, thereby achieving the effect for dissipating heat from the substrate assembly and the storage device at the same time.
Description
technical field [0001] The invention relates to the technical field of unmanned aerial vehicles, in particular to a heat dissipation structure and an unmanned aerial vehicle with the heat dissipation structure. Background technique [0002] At present, electronic products with high heat flux, such as drones and camera gimbals, are equipped with heat dissipation structures to dissipate heat from chips, storage or other heat dissipation components in the electronic products, thereby ensuring the normal operation of the electronic products. The traditional heat dissipation structure usually adopts the method of fan plus heat dissipation pipe, and the heat dissipation efficiency is low. [0003] However, with the continuous improvement of technology, the requirements for the storage space and storage speed of drone cameras are also getting higher and higher. Therefore, in the prior art, a solution such as adding a solid state drive (Solid State Drives, SSD) to the unmanned aeri...
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IPC IPC(8): H05K7/20
CPCH05K7/20145
Inventor 彭涛欧迪才志伟郭晓凯
Owner SZ DJI TECH CO LTD