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Melt processible fluoropolymer composition with excellent heat conductivity, molded product manufactured from the composition and manufacturing method

A melt processing, polymer technology, applied in heat exchange materials, chemical instruments and methods, semiconductor devices, etc., can solve the problems of increased melt viscosity, high melt viscosity, low thermal conductivity, etc., to achieve high insulation properties, excellent flexibility properties, excellent thermal conductivity

Active Publication Date: 2017-08-29
DUPONT MITSUI FLUOROCHEMICALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

(2) When melt mixing, due to the high melt viscosity and stress applied to the filler, the filler is easily destroyed
(4) In particular, when fine fillers are added, the melt viscosity of the composition increases, and the problems mentioned in (1) to (3) (the fillers are not easily dispersed, the fillers are destroyed by pressure, and voids are formed) are more likely to occur
However, all the resulting polymer compositions have low thermal conductivity of 2 W / mK or less, which is insufficient

Method used

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  • Melt processible fluoropolymer composition with excellent heat conductivity, molded product manufactured from the composition and manufacturing method
  • Melt processible fluoropolymer composition with excellent heat conductivity, molded product manufactured from the composition and manufacturing method
  • Melt processible fluoropolymer composition with excellent heat conductivity, molded product manufactured from the composition and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0127] PFA1 (as a melt processable fluoropolymer), boron nitride spherical aggregate particles (A) (average particle size: 70 μm) and boron nitride spherical aggregate particles (B) (average particle size: 40 μm) were respectively Mix at a volume ratio of 43:54:3, combine so that the total amount is 30 g, and then use a coffee grinder (BC-1752J manufactured by Yamada Electric IND. Co., Ltd.) at room temperature Dry blend for 15 seconds to obtain a blended composition.

[0128] The obtained mixed composition was placed in a predetermined metal mold (dimensions: 55 mm in diameter, 30 mm in height), and after holding at 360° C. for 15 minutes, a compression molding machine (manufactured by Shinto Metal Industries Corporation) was used. hot press WFA-37, cylinder diameter: 152 mm), melt compression molding was carried out under the compression molding machine internal pressure (hydraulic pressure) of 1 MPa to obtain molded product samples. The thermal conductivity (according to m...

Embodiment 2

[0142] A composition was obtained by mixing under the same conditions as in Example 1, except that boron nitride anisotropic particles (B) (average particle diameter: 30 μm, aspect ratio: 150) were used instead of boron nitride spherical aggregates Bulk particles (B) (average particle diameter: 40 μm). The compositions were then molded, and molded articles were prepared and evaluated in the same manner. The results for the thermal conductivity of the molded article were favorable at 10.9 W / mK.

Embodiment 3

[0144] The composition was obtained by mixing under the same conditions as in Example 1, except that the amount of PFA1 was increased from 43% to 45% and the amount of boron nitride spherical aggregate particles (B) was decreased from 3% to 1%, while maintaining the amount of boron nitride spherical aggregate particles (A) at 54%. The compositions were then molded, and molded articles were prepared and evaluated in the same manner. The results for the thermal conductivity of the molded article were favorable at 10.9 W / mK.

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Abstract

The present invention is a polymer composition, containing: 30 to 60 volume% of a melt processable fluoropolymer; and 40 to 70 volume% of boron nitride particles; wherein the boron nitride particles are made from particles (A) and particles (B), the particles (A) are spherical aggregate particles with an average particle diameter of 55 [mu]m to 100 [mu]m, and an aspect ratio of 1 to 2, the particles (B) are particles with an average particle diameter of 8 [mu]m to 55 [mu]m, and the volume ratio of the particles (A) to the total amount of boron nitride is 80 to 99 volume%. The polymer compositions have excellent moldability, insulation properties, heat conductivity, and heat resistance, and are suitable as raw materials for sufficiently strong molded products, such as thin films.

Description

[0001] Cross references to related patent applications [0002] This patent application claims priority from Japanese Patent Application No. 2014-235955 filed on November 20, 2014, which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to melt processable fluoropolymer compositions having excellent thermal conductivity, electrical properties and plasticity. Background technique [0004] Heat increases as semiconductors are miniaturized and integrated, and therefore, heat dissipation materials with high thermal conductivity and high insulation characteristics must be used as materials for configuring semiconductors. In particular, power semiconductors for power control and power modules including power semiconductor elements generate more heat, and thus, heat dissipation materials that can effectively dissipate heat are required. In order to dissipate heat effectively, the heat dissipating material not only needs to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/12C08K7/16C08K3/38C09K5/14
CPCC08K3/38C08K7/16C09K5/14C08K2201/016C08K2201/014C08K2201/005C08K2201/003C08K2003/385C08L27/12H01L23/3737C08K2201/001H01L2924/0002H01L2924/00C08J3/005C08J3/203C08J5/18C08J2327/12C08L2205/18
Inventor P.H.南M.诺达K.纳卡O.哈亚卡瓦
Owner DUPONT MITSUI FLUOROCHEMICALS CO LTD
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