Galvanic plating device for horizontal galvanic plating treatment line for galvanic metal deposition and use thereof
An electroplating device and electroplating treatment technology, applied in the direction of current insulation device, printed circuit secondary treatment, contact device, etc., can solve the problems of undesired qualitative metal deposition results and distribution, substrate wrinkling, etc., to ensure safe transportation, The effect of avoiding damage
Active Publication Date: 2019-01-15
ATOTECH DEUT GMBH
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Problems solved by technology
[0005] This leads to completely new technical challenges in transporting and handling the substrates to be processed
The market demand for substrates with a thickness as low as 25 micrometers creates serious problems where said thin flexible substrates cannot be damaged by contact between individual conveying rollers or axles below or above the conveying level of a conveying or processing line. Safely transport the thin flexible substrates without wrinkling or damage from undesired running
This leads to undesirable qualitative metal deposition results and distribution
In the worst case, the bending effect is so strong that the substrate becomes wrinkled between the individual conveying elements
Method used
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[0030] As used herein, the term "galvanic plating apparatus" refers to the apparatus required to perform an galvanic process for depositing a desired galvanic metal (such as copper, tin, gold, silver, etc.) on a substrate to be treated on the surface. This means that this galvanic plating device represents the "core" unit of a horizontal galvanic plating process line for galvanic metal (copper in particular) deposition. There is a certain number of pre- and post-processing steps, such as rinsing, drying, etching, etc., arranged before and after the galvanic plating device. However, the main or core step is still the galvanic plating process step itself which has to be carried out in said improved inventive galvanic plating apparatus of the present invention.
[0031] As used herein, the term "galvanic plating module" refers to an apparatus element or subunit of a galvanic plating apparatus arranged below and / or above a conveying level of a substrate to be processed. It has b...
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The present invention relates to a galvanic electroplating device for horizontal galvanic electroplating treatment lines for galvanic metal, in particular copper deposition; wherein the galvanic electroplating device comprises at least a first current arranged below the conveying level of the substrate to be treated An electroplating module and at least one electroplating fixture disposed on the first side of the current electroplating device; wherein the first electroplating module includes at least one electrolyte nozzle and at least one anode element located inside the current electroplating module, wherein all The current electroplating module further includes at least one cover plate having a plurality of openings disposed above the anode element and the electrolyte nozzle, wherein the current electroplating device further includes a cover plate disposed on the cover plate of the current electroplating module. At least one substrate guide element on a surface, wherein the substrate guide element is bonded to the surface of the cover plate of the current plating module. The invention further relates to the use of this galvanic electroplating device for galvanic metal, preferably copper, deposition on printed circuit foils, flexible printed circuit boards and embedded chip substrates.
Description
technical field [0001] The present invention relates to a galvanic plating device of a horizontal galvanic plating treatment line for the deposition of galvanic metals, in particular copper; wherein said galvanic plating device comprises at least one first a galvanic plating module, and at least one electroplating fixture arranged on a first side of said galvanic plating device; wherein said first galvanic plating module comprises at least one electrolyte nozzle and at least one anode element located inside said galvanic plating module, Wherein the galvanic plating module further includes at least one cover plate with a plurality of openings arranged above the anode element and the electrolyte nozzle. [0002] The invention is further directed to the use of such a galvanic plating device for galvanic metal, preferably copper, deposition on printed circuit foils, flexible printed circuit boards and embedded chip substrates. Background technique [0003] For decades, industry...
Claims
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IPC IPC(8): C25D17/00C25D5/08H05K3/24
CPCC25D17/008C25D5/08C25D7/00C25D17/00C25D17/005H05K3/241
Inventor 费迪南多·温诺菲利克斯·莫伦
Owner ATOTECH DEUT GMBH