A kind of non-stoichiometric ratio tic reinforced copper matrix composite material and preparation method thereof

Abstract

The invention discloses a non-stoichiometric ratio TiC reinforced copper-based composite and a preparation method thereof and belongs to the technical field of metallurgical composites. The composite is composed of, by mass percentage, 1-5% of non-stoichiometric ratio TiC particles and the balance a base body copper alloy. The base body copper alloy is a Cu-Ni-Sn-Si alloy. The preparation method comprises the following steps of 1, conducting vacuum in-situ reactive sintering on Ti2SnC, Ti3SiC2 and Cu powder to prepare a non-stoichiometric ratio TiC / Cu intermediate material; 2, placing Cu into a vacuum induction smelting furnace, after the Cu is fully molten, sequentially adding Ni, the TiC / Cu intermediate material, Sn and Si into the vacuum induction smelting furnace for smelting, so that a non-stoichiometric ratio TiC / Cu-Ni-Sn-Si powder material is obtained, and then conducting gas atomization treatment on the TiC / Cu-Ni-Sn-Si powder material, so that prealloy powder is obtained; and 3, conducting ball milling, cold pressing for blank production, vacuum sintering, extrusion and heat treatment on the prealloy powder, so that the TiC / Cu-based composite is obtained. The non-stoichiometric ratio TiC reinforced copper-based composite has the beneficial effects of being good in strength, low in friction coefficient, high in abrasion resistance and the like.

Description

technical field [0001] The invention relates to the technical field of metallurgical composite materials, in particular to a non-metered ratio TiC reinforced copper-based composite material and a preparation method thereof. Background technique [0002] A long time ago, people began to add ceramic particles such as TiC to Cu to prepare high-strength and high-temperature resistant Cu-based composite materials. However, the mutual solubility of TiC and Cu is very small, the wettability of Cu to TiC is poor, and the wetting angle is still large even at high temperature, and the wetting angle is 109° in a vacuum state of 1200 °C, which is not conducive to Form a good interface bond, and due to the large surface energy between the fine reinforcement particles, it is easy to agglomerate during curing, and it is difficult to prepare a uniformly distributed small-size reinforcement phase in the matrix, which hinders the TiC / Cu-based composite material. Overall performance improveme...

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Problems solved by technology

[0003] At present, there are at least two problems in the conventional in-situ direct reaction system to generate non-stoichiometric TiCx phases: (1) The formation energy of TiCx increases rapidly with the decrease of x value, and the reaction products tend to be TiC rather than non-stoichiometric TiCx, so it is difficult to avoid the existence of TiC phase; (2) the reaction is difficult to fully proceed, the existence of residual reaction phase is inevitable, often there will be incompletely reacted graphite phase, natural non-wetting between graphite and Cu, residual graphite It is difficult to form a strong interface with the Cu matrix, which affects the performance of the material

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