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A Combination Probe of Single Chip and Phased Array Ultrasound

A single-chip, phased array technology, which is used in material analysis, instruments, and measuring devices using sonic/ultrasonic/infrasonic waves. The effect of resolution

Active Publication Date: 2019-12-27
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally speaking, under the equivalent sensitivity of a Φ0.4mm flat-bottomed hole, the conventional focusing probe can distinguish defects with a depth of about 1.5mm, while the phased array technology can only distinguish defects with a depth of 3mm and above

Method used

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  • A Combination Probe of Single Chip and Phased Array Ultrasound

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0014] For the detection of the high-pressure turbine baffle of an engine, the central single-chip probe used is a water-immersion point-focused ultrasonic probe with a center frequency of 10MHz and a focal length in water of 76mm. The number of circular array elements in the phased array probe is 14.

[0015] During the inspection, the high-pressure turbine baffle of the engine to be inspected and the single-chip and phased-array ultrasonic combined probe are immersed in the water tank at the same time. The single-chip and phased-array ultrasonic combined probe is located directly above the part to be tested. The central axis of the combination probe is perpendicular to the upper surface of the part to be inspected, and the distance from the surface of the part to be inspected is 60mm; connect the UHF connector and the phased array cable to the pulse transmitting and receiving port of the ultrasonic detector, and the ultrasonic wave emitted by the central single chip probe pas...

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Abstract

The invention belongs to the technical field of nondestructive detection and relates to a single crystal wafer and phased array ultrasonic combined probe. The single crystal wafer and phased array ultrasonic combined probe is characterized by comprising a central single crystal wafer probe (1) and an annular phased array probe (2); and the annular phased array probe (2) surrounds the central single crystal wafer probe (1). The single crystal wafer and phased array ultrasonic combined probe provided by the invention overcomes the defect of poor near-surface resolving power of ultrasonic phased array detection, so that the single crystal wafer and phased array ultrasonic combined probe achieves high near-surface resolving power while having the advantages of high efficiency and flexibility in ultrasonic phased array detection.

Description

technical field [0001] The invention belongs to the technical field of non-destructive testing, and relates to a combined single chip and phased array ultrasonic probe. Background technique [0002] Phased array technology has been widely used in ultrasonic testing of industrial parts in recent years. Different from conventional single-element ultrasonic inspection, phased array technology uses a phased array probe with multiple elements for inspection. By controlling the delay time for each chip to transmit and receive ultrasonic waves, specific behaviors such as deflection and focusing of ultrasonic beams can be controlled. The design of ultrasonic phased array probes is based on Huygens' principle. The transducer is composed of multiple independent piezoelectric wafers, and each wafer is called a unit. According to certain rules and timing, the electronic system is used to control and excite each unit, so that the ultrasonic waves emitted by each unit in the array are s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N29/24
CPCG01N29/24G01N2291/0289G01N2291/044
Inventor 沙正骁梁菁史亦韦江运喜权鹏胡耀文
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS