LD chip eutectic welding system

Abstract

The invention discloses an LD chip eutectic welding system which comprises a base. An LD chip welding displacement mechanism is arranged on the upper side of the base. A carrier loading and unloading mechanism is arranged on the other upper side of the base. The LD chip welding displacement mechanism comprises two support plates. An LD chip separation device, an LD chip angle correction device, an eutectic welding station, a ceramic chip angle correction device and a ceramic chip separation device are successively arranged with spacing below two support plates. A suction nozzle sliding rail is fixed on the upper end of two support plates. A vision support plate is fixed above the suction nozzle sliding rail. The LD chip welding displacement mechanism comprises a stripe-shaped casing. A cylinder fixing base crosses the middle of the stripe-shaped casing. A movable cylinder is arranged on the cylinder fixing base. The movable cylinder horizontally drives a tube base suction nozzle module which can slide between the stripe-shaped casing and the eutectic welding station. According to the invention, the processing efficiency can be improved, and an eutectic welding process can be completed in a small space.

Description

technical field [0001] The invention relates to the field of LD processing, in particular to an LD chip eutectic welding system which can improve the processing efficiency and complete the eutectic welding process in a small space. Background technique [0002] LD (semiconductor laser) has many advantages such as high efficiency, long life, good beam quality, small size, light weight, and full curing. It has developed rapidly in recent years and has become the most interesting research hotspot in the laser field in the world today. In the three aspects of LD's chip manufacturing, die (module) packaging and product application, the packaging process and equipment are closer to the market, and have a more direct role in promoting the industry. Among them, the eutectic soldering technology is one of the most critical core technologies in the next-generation flip-chip high-power LD chip packaging process. The quality of the eutectic soldering technology will directly affect the ...

AI Technical Summary

Problems solved by technology

The eutectic welding process has a total of 3 parts, which are the tube base, the ceramic chip and the LD chip (the size length*width*height is 1.5*1.0*0.6mm). First, the ceramic chip is welded on the base by the eutectic method. Then the LD chip is welded to the ceramic chip by eutectic method. The current eutectic soldering station completes the welding process from one direction to another through a production line. This production line has low processing efficiency and occupies a large area of ​​equipment.

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